Phatlalatso e ncha ho tsoa ho Samsung Electronics hore e se e qalile tlhahiso e kholo ea 3D NAND e nang le likarolo tse fetang 100. Tlhophiso e phahameng ka ho fetisisa e ka khonehang e lumella li-chips tse nang le likarolo tse 136, tse tšoaeang mohato o mocha tseleng ea ho hopola memori e teteaneng ea 3D NAND. Ho haella ha tlhophiso e hlakileng ea mohopolo ho fana ka maikutlo a hore chip e nang le likarolo tse fetang 100 e kopantsoe ho tloha ho tse peli kapa, mohlomong, tse tharo tsa monolithic 3D NAND e shoa (mohlala, 48-layer). Nakong ea ts'ebetso ea likristale tsa soldering, likarolo tse ling tsa moeli li senngoa, 'me sena se etsa hore ho se ke ha khoneha ho bontša ka nepo palo ea likarolo tsa kristale, e le hore Samsung e se ke ea qosoa hamorao ka ho se nepahale.
Leha ho le joalo, Samsung e tsitlallela ho etching e ikhethang ea lesoba la mocha, e bulang monyetla oa ho phunya ka botenya ba sebopeho sa monolithic le ho hokahanya li-memory flash memory memory chip e le 'ngoe. Lihlahisoa tsa pele tsa 100-layer e ne e le li-chips tsa 3D NAND TLC tse nang le bokhoni ba 256 Gbit. Khamphani e tla qala ho hlahisa lichifi tsa 512-Gbit tse nang le likarolo tse 100 (+) hoetla hona ho tlang.
Ho hana ho lokolla mohopolo oa bokhoni bo phahameng ho boleloa ke 'nete (mohlomong) hore boemo ba bokooa ha ho lokolloa lihlahisoa tse ncha ho bonolo ho laola tabeng ea mohopolo oa matla a tlaase. Ka "ho eketsa palo ea mekato," Samsung e ile ea khona ho hlahisa chip e nang le sebaka se senyenyane ntle le ho lahleheloa ke matla. Ho feta moo, chip e fetohile e bonolo ka litsela tse ling, kaha joale ho e-na le likoti tse emeng tse limilione tse 930 ho monolith, ho lekane ho koala masoba a limilione tse 670 feela. Ho latela Samsung, sena se nolofalitse le ho khutsufatsa lipotoloho tsa tlhahiso mme se nolofalitse keketseho ea 20% ea tlhahiso ea basebetsi, e bolelang litšenyehelo tse ngata le tse tlase.
Ho ipapisitsoe le mohopolo oa 100-layer, Samsung e qalile ho hlahisa 256 GB SSD e nang le SATA interface. Lihlahisoa li tla fuoa li-PC OEMs. Ha ho na pelaelo hore haufinyane Samsung e tla hlahisa li-drive tse tšepahalang le tse theko e tlase haholo.
Phetoho ea sebopeho sa 100-layer ha ea ka ea re qobella ho tela ts'ebetso kapa tšebeliso ea matla. 256 Gbit 3D NAND TLC e ncha e ne e le 10% ka potlako ho feta mohopolo oa 96-layer. Moralo o ntlafalitsoeng oa lisebelisoa tsa elektronike tsa chip o entse hore ho khonehe ho boloka sekhahla sa phetisetso ea data ka mokhoa oa ho ngola ka tlase ho 450 μs, le ka mokhoa oa ho bala ka tlase ho 45 μs. Ka nako e ts'oanang, tšebeliso e fokotsehile ka 15%. Ntho e khahlisang haholo ke hore e ipapisitse le 100-layer 3D NAND, k'hamphani e ts'episa ho lokolla 300-layer 3D NAND ka mor'a moo, ka ho kopanya likristale tse tharo tse tloaelehileng tsa monolithic 100-layer. Haeba Samsung e ka qala tlhahiso e boima ea 300-layer 3D NAND selemong se tlang, e tla ba raha e bohloko ho bahlolisani le indasteri ea memori ea flash.
Source: 3dnews.ru