Samsung e nka monyetla ka botlalo molemong oa eona oa bopula-maliboho ho semiconductor lithography e sebelisa liskena tsa EUV. Ha TSMC e itokisetsa ho qala ho sebelisa li-scanner tsa 13,5 nm ka Phuptjane, e li fetola hore li hlahise li-chips molokong oa bobeli oa ts'ebetso ea 7 nm, Samsung e ntse e qoela ka botebo.
Bokhoni ba Samsung ba ho tloha ka potlako ho fana ka theknoloji ea 7nm le EUV ho hlahisa litharollo tsa 5nm ka EUV bo boetse ba thusoa ke Samsung ho boloka tšebelisano lipakeng tsa likarolo tsa moralo (IP), lisebelisoa tsa moralo le lisebelisoa tsa tlhahlobo. Har'a lintho tse ling, sena se bolela hore bareki ba k'hamphani ba tla boloka chelete ka ho reka lisebelisoa tsa moralo, liteko le li-block tsa IP tse lokiselitsoeng. Li-PDK tsa moralo, mokhoa (DM, mekhoa ea meralo) le li-platform tsa meralo tse ikemetseng tsa EDA li ile tsa fumaneha e le karolo ea nts'etsopele ea li-chips bakeng sa litekanyetso tsa Samsung tsa 7-nm le EUV kotareng ea bone ea selemo se fetileng. Lisebelisoa tsena kaofela li tla netefatsa nts'etsopele ea merero ea dijithale hape bakeng sa theknoloji ea ts'ebetso ea 5 nm ka li-transistor tsa FinFET.
Ha ho bapisoa le ts'ebetso ea 7nm e sebelisang li-scanner tsa EUV, tseo k'hamphani
Samsung e hlahisa lihlahisoa tse sebelisang li-scanner tsa EUV femeng ea S3 e Hwaseong. Karolong ea bobeli ea selemo sena, k'hamphani e tla phethela kaho ea setsi se secha haufi le Fab S3, se tla be se loketse ho hlahisa lichifi ho sebelisa mekhoa ea EUV selemong se tlang.
Source: 3dnews.ru