U-Intel wajoyina i-CHIPS Alliance kwaye wanika ihlabathi i-Advanced Interface Bus

Imigangatho evulekileyo ifumana abalandeli abaninzi nangakumbi. Iingxilimbela zemarike ye-IT zinyanzelwa ukuba zingayithatheli ingqalelo kuphela le nto, kodwa nokunika uphuhliso lwazo olulodwa lokuvula uluntu. Umzekelo wamva nje yayikukugqithiselwa kwebhasi ye-Intel AIB kwi-CHIPS Alliance.

Kule veki i-Intel waba lilungu le-CHIPS Alliance (I-Hardware ye-Hardware ye-Interfaces, i-Processors kunye ne-Systems). Njengoko isifinyezo se-CHIPS sithetha, le manyano yezoshishino isebenza ekuphuhliseni uluhlu olupheleleyo lwezisombululo ezivulekileyo ze-SoC kunye ne-high-density chip packaging, umzekelo, i-SiP (i-system-in-packages).

Ukuba lilungu lomanyano, i-Intel yanikela ngebhasi eyenziwe kubunzulu bayo kuluntu Advanced Interface Bus (AIB). Ewe kunjalo, hayi ngenxa ye-altruism emsulwa: nangona ibhasi ye-AIB iya kuvumela wonke umntu ukuba enze ujongano olusebenzayo lwe-interchip ngaphandle kokuhlawula imali kwi-Intel, inkampani ikwalindele ukunyusa ukuthandwa kwee-chiplets zayo.

Ibhasi ye-AIB iphuhliswa yi-Intel phantsi kwenkqubo ye-DARPA. Umkhosi wase-US kudala unomdla kwingqiqo edibeneyo ebandakanya iichips ezininzi. Inkampani yazisa isizukulwana sokuqala sebhasi ye-AIB kwi-2017. Isantya sotshintshiselwano sifike kwi-2 Gbit / s ngaphezulu komgca omnye. Isizukulwana sesibini sevili le-AIB saziswa kunyaka ophelileyo. Isantya sotshintshiselwano siye sanyuka ukuya kwi-5,4 Gbit / s. Ukongeza, ibhasi ye-AIB inikezela ngeyona nto ingcono kakhulu yoxinzelelo lwedatha kwi-mm: 200 Gbps. Kwiiphakheji ezininzi ze-chip, le yeyona parameter ibaluleke kakhulu.

Kubalulekile ukuqaphela ukuba ibhasi ye-AIB ayinandaba nenkqubo yokuvelisa kunye nendlela yokupakisha. Inokuthi iphunyezwe nokuba kukupakishwa kwe-Intel EMIB yendawo ezininzi okanye kwi-TSMC ekhethekileyo yokupakisha ye-CoWoS okanye kwipakethe yenye inkampani. Ukuguquguquka konxibelelwano kuya kukhonza imigangatho evulekileyo kakuhle.

Ngexesha elifanayo, kufuneka kukhunjulwe ukuba elinye uluntu oluvulekileyo, iProjekthi ye-Open Compute, iphinda iphuhlise ibhasi yayo yokudibanisa i-chiplets (iikristali). Le yibhasi ye-Open Domain-Specific Architecture (I-ODSA). Iqela elisebenzayo lokudala i-ODSA lenziwe kutsha nje, ngoko ke i-Intel ijoyina i-CHIPS Alliance kwaye inikezela ngebhasi ye-AIB kuluntu inokuba ngumdlalo osebenzayo.

umthombo: 3dnews.ru