I-Apple ibikwiingxoxo kunye ne-Intel malunga nokufumana inxalenye yeshishini lemodem ye-Intel ye-smartphone, iWall Street Journal (WSJ) ibike. Umdla we-Apple kwitekhnoloji ye-Intel ichazwa ngumnqweno wokukhawulezisa ukuphuhliswa kweechips zayo zemodem kwii-smartphones.
Ngokutsho kwe-WSJ, i-Intel kunye ne-Apple yaqala uthethathethwano lwehlobo elidlulileyo. Iingxoxo zaqhubeka iinyanga ezininzi kwaye zaphela ngexesha elifanayo ukuba i-Apple ilungise ingxabano yayo neQualcomm.
Imithombo e-Intel ixelele i-WSJ ukuba inkampani ithathela ingqalelo "ezinye iindlela zobuchule" kwishishini layo lemodem ye-smartphone kwaye ihlala inomdla wokuyithengisa kwi-Apple okanye kwenye inkampani.
Kwangoko kule nyanga, i-Intel ibhengeze ukuba iyaphuma kwishishini lemodem ye-smartphone ye-5G. Oku kwaziwa kwiiyure nje ezimbalwa emva kokuba i-Apple kunye ne-Qualcomm babhengeze ukuba basombulule ingxabano kwaye bangena kwisivumelwano esitsha sokubonelela.
NgoLwesihlanu ophelileyo, i-Intel CEO uRobert Swan , ukuba isigqibo senkampani sokushiya i-market network ye-5G ye-mobile network yabangelwa ukuqaliswa kwentsebenziswano phakathi kwe-Apple kunye ne-Qualcomm. Emva koku, i-Intel yafikelela kwisigqibo sokuba yayingenawo amathemba okusebenza okunenzuzo kweli candelo lemarike.
umthombo: 3dnews.ru
