- Le mveliso iya kuba yiprosesa yemizobo eyenzelwe ukukhawulezisa ikhompyuter kwiinkqubo zeseva.
- Imveliso nge-watt nganye iya kunyuka nge-20%, ubuninzi bee-transistors kufuneka buphindwe kabini.
- Ngo-2020, i-Intel iya kuba nexesha lokukhulula iprosesa yemizobo ye-10nm.
- Kuze kube yi-2023, izizukulwana ezithathu zeteknoloji yenkqubo ye-7nm iya kutshintsha.
I-Intel isandula kubamba umsitho womtyali-mali oyilelwe ukufaka ukuzithemba kwiingqondo ezipholileyo, ezinengqiqo ze-CPU kunye nomphuhlisi we-GPU amandla obugcisa kunye nemali. Ewe, ewe, abameli be-Intel abazange banikele ingqalelo engaphantsi kohlobo lokugqibela lwamacandelo kwiingxelo zabo kunakwiiprosesa eziphambili.
Ekusukeleni TSMC
I-CEO uRobert Swan uthethe nabatyali-mali malunga nolwalathiso lwe-Intel ngokubanzi lophuhliso kunye nenguqu, kodwa wakubona kuyimfuneko ukuchaza ukuba i-corporation iya kutyala izibonelelo ezinzulu ekugcineni ubunkokeli bayo kubuchwepheshe be-lithography. Kubo bonke ubunzima, inkqubela phambili ye-Intel kule ndawo yathelekiswa nempumelelo ye-TSMC. Iiprosesa zokuqala ze-10nm ze-Ice Lake zeelaptops ziya kwaziswa ngoJuni, iiprosesa zeseva ye-Ice Lake-SP ziya kubonakala kwisiqingatha sokuqala sika-2020, xa i-TSMC iya kubonelela abathengi bayo ngemveliso ye-7nm. Ewe, ngo-2021, i-Intel ilindele ukukhupha iimveliso zayo zokuqala ze-7nm- ngelo xesha i-TSMC iya kube ivelisa iimveliso ze-5nm.
Ngokubanzi, eyona nto iphambili
I-teknoloji yenkqubo ye-7-nm yesizukulwana sokuqala iya kuphinda kabini ukuxinana kwee-transistors xa kuthelekiswa nenkqubo ye-10-nm, ukwandisa ukusebenza kwe-transistor nge-20% ngokumalunga nokusebenza kwe-watt nganye yamandla asetyenzisiweyo, kunye nokwenza lula inkqubo yokuyila ngamaxesha amane. Ngethuba lokuqala, i-Intel iya kusebenzisa i-ultra-hard ultraviolet lithography ngaphakathi kwesakhelo se-7 nm iteknoloji. Ukongeza, iFoveros heterogeneous layout kunye nesizukulwana esitsha se-EMIB substrate iya kwaziswa kwinqanaba elifanayo.
Itekhnoloji yenkqubo ye-7-nm ngokwayo, ngokutsho kwenkcazo ye-Intel, iya kudlula izigaba ezithathu kuphuhliso lwayo, kunye nentsha evela minyaka le, ukuya kuthi ga kwi-2023 ibandakanyiwe. Itekhnoloji ye-7-nm iya kusebenzisa ngokupheleleyo i-layout evumela ukuba iikristale ezingafaniyo zidityaniswe kwi-substrate enye-ebizwa ngokuba yi "chiplets."
Owamazibulo kwitekhnoloji yenkqubo ye-7nm iya kuba sisisombululo segraphics esicacileyo
Imveliso yokuqala eveliswe kusetyenziswa iteknoloji ye-7nm kufuneka iboniswe ngo-2021. Sele isaziwa ukuba le iya kuba yinkqubo yegraphics yenjongo ngokubanzi eya kufumana isicelo kumaziko edatha kunye neenkqubo zobukrelekrele bokwenziwa. Ngelixa i-Intel yayikhe yachasa ukubiza "Intel Xe" yi-architecture, yiloo nto kanye abayenzayo kumboniso wabo wotyalo-mali. Kubalulekile ukuba uqaphele ukuba umntwana wokuqala we-7nm uya kuhlanganiswa kwiikristale ezingafaniyo kwaye uya kusebenzisa iindlela zokupakisha eziphambili.
I-Intel igxininisa ngokukodwa ukuba ngaphambi koku, iprosesa yegraphics ecacileyo iya kukhutshwa ngo-2020, eya kuveliswa ngokusebenzisa iteknoloji ye-10nm. Kunokwenzeka ukuba iyakunciphisa umda wayo kwicandelo labathengi, kwaye i-Intel iya kugcina inguqulo ye-7-nm yecandelo lomncedisi. Njengoko kuphawuliwe ngaphambili, i-Intel's discrete GPUs iya kusebenzisa uyilo oluzuzwe njengelifa kwimizobo edibeneyo. Umanduleli kwezi mveliso iya kuba yimizobo yesizukulwana se-Gen11 eya kuthi i-Intel izakhele uninzi lweemveliso zayo ze-10nm.
Xa yayilithuba leCFO entsha ye-Intel, uGeorge Davis, wakhawuleza wathi ekufuneni ukuphucula iimpawu zabathengi beemveliso ngexesha lokutshintsha ukusuka kwi-10-nm ukuya kwi-7-nm yeteknoloji yenkqubo, inkampani iya kuzama ukusebenzisa imali ngobulumko. Ewe, emva kokuqonda inkqubo yezobugcisa be-7-nm, ukukhutshwa kwezizukulwana ezitsha zeemveliso kufuneka kuqinisekise ukunyuka kwengeniso ethile yabatyalo-mali ngesabelo ngasinye.
umthombo: 3dnews.ru