Xa iiprosesa zedesktop zaqala zaphula i-1 GHz, okwethutyana kwakubonakala ngathi akukho ndawo yokuya. Ekuqaleni, kwakunokwenzeka ukwandisa ukuphindaphinda ngenxa yeenkqubo ezintsha zobugcisa, kodwa inkqubela yeefrikhwensi ekugqibeleni yathotha ngenxa yeemfuno ezikhulayo zokususwa kobushushu. Nokuba iiradiator ezinkulu kunye nabalandeli ngamanye amaxesha abanalo ixesha lokususa ubushushu kwezona chips zinamandla.
Abaphandi baseSwitzerland bagqiba kwelokuba bazame ngokudlula ulwelo ngekristale ngokwayo. Bayila itshiphu kunye nenkqubo yokupholisa njengeyunithi enye, enemijelo ye-on-chip fluid ebekwe kufutshane neendawo ezishushu zetshiphu. Isiphumo kukunyuka okumangalisayo ekusebenzeni kunye nokutshatyalaliswa kobushushu obusebenzayo.
Inxalenye yengxaki yokususa ubushushu kwi-chip kukuba ngokuqhelekileyo kubandakanya izigaba ezininzi: ukushisa kudluliselwa kwi-chip ukuya kwi-chip packaging, emva koko ukusuka kwipakethe ukuya kwi-heatsink, emva koko ukuya emoyeni (i-thermal paste, amagumbi omoya, njl. .inokubandakanyeka kwinkqubo Ngaphezulu). Lilonke, oku kunciphisa ubungakanani bobushushu obunokususwa kwi-chip. Oku kuyinyaniso nakwiinkqubo zokupholisa ulwelo ezisetyenziswayo ngoku. Kunokwenzeka ukuba ubeke i-chip ngqo kwi-thermal conductive liquid, kodwa le yokugqibela akufanele iqhube umbane okanye ingene kwi-chemical reactions kunye namacandelo e-elektroniki.
Sele kukho imiboniso emininzi yokupholisa ulwelo kwi-chip. Ngokuqhelekileyo sithetha ngenkqubo apho isixhobo esineseti yamajelo olwelo sidityaniswe kwikristale, kwaye ulwelo ngokwalo luphoswa ngalo. Oku kuvumela ubushushu ukuba bususwe ngokufanelekileyo kwi-chip, kodwa ukuphunyezwa kokuqala kubonise ukuba kukho uxinzelelo oluninzi kwimijelo kunye nokumpompa amanzi ngale ndlela kufuna amandla amaninzi - ngaphezu kokususwa kwiprosesa. Oku kunciphisa amandla okusebenza kwenkqubo kwaye ukongezelela kudala uxinzelelo oluyingozi lomatshini kwi-chip.
Uphando olutsha luphuhlisa iingcamango zokuphucula ukusebenza kakuhle kweenkqubo zokupholisa kwi-chip. Ukufumana isisombululo, iinkqubo zokupholisa ezintathu-dimensional zingasetyenziswa - i-microchannels ene-collector eyakhelwe ngaphakathi (i-microchannels edibeneyo edibeneyo, i-EMMC). Kuzo, i-dimensional-dimensional hierarchical manifold licandelo letshaneli enamazibuko amaninzi okusasazwa kwesipholisi.
Abaphandi baphuhlise i-monolithically manifold manifold microchannel (mMMC) ngokudibanisa i-EMMC ngqo kwi-chip. Imijelo efihliweyo yakhiwe kanye phantsi kweendawo ezisebenzayo ze-chip, kwaye i-coolant ihamba ngokuthe ngqo phantsi kwemithombo yobushushu. Ukudala i-mMMC, okokuqala, iindawo zokubeka ezinqamlekileyo zeziteshi zifakwe kwi-silicon substrate ehlanganiswe ne-semiconductor-gallium nitride (GaN); emva koko i-etching ngegesi ye-isotropic isetyenziselwa ukwandisa izithuba kwi-silicon ukuya kububanzi bejelo elifunekayo; Emva koko, imingxuma kwiGaN layer phezu kwemijelo ivalwe ngobhedu. I-chip inokuveliswa kwi-GaN layer. Le nkqubo ayifuni inkqubo yokudibanisa phakathi komqokeleli kunye nesixhobo.
Abaphandi basebenzise imodyuli ye-elektroniki yamandla eguqula i-alternating current ukuya ngqo ngoku. Ngoncedo lwayo, ukuhamba kokushisa okungaphezulu kwe-1,7 kW / cm2 kunokupholisa ngokusebenzisa amandla okupompa kuphela i-0,57 W / cm2. Ukongeza, inkqubo ibonisa ukusebenza kakuhle kakhulu kokuguqulwa kunesixhobo esifanayo esingapholiyo ngenxa yokungabikho kokuzifudumeza.
Nangona kunjalo, akufanele ulindele ukubonakala okusondeleyo kwee-chips ezisekelwe kwi-GaN kunye nenkqubo yokupholisa edibeneyo - inani lemiba engundoqo lisafuna ukusonjululwa, njengokuzinza kwenkqubo, imida yobushushu, njalo njalo. Ukanti, eli linyathelo elibalulekileyo eliya phambili elisingise kwikamva eliqaqambileyo nelibandayo.
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umthombo: 3dnews.ru