I-Intel ithetha kakhulu malunga nobeko lwesithuba se-Foveros processors, iye yavavanya kwi-Lakefield ehambayo, kwaye ekupheleni kuka-2021 iyisebenzisa ukwenza iiprosesa zegraphics ze-7nm. Kwintlanganiso phakathi kwabameli be-AMD kunye nabahlalutyi, kwacaca ukuba iingcamango ezinjalo azikho ezingaqhelekanga kule nkampani.
Kumsitho wamva nje we-FAD ka-2020, i-AMD CTO uMark Papermaster ukwazile ukuthetha ngokufutshane malunga nendlela yekamva yophuhliso lwezisombululo zokupakisha. Emuva kwi-2015, i-Vega graphics processors isebenzise into ebizwa ngokuba yi-2,5-dimensional layout, xa i-memory chips ye-HBM ibekwe kwi-substrate efanayo kunye ne-GPU crystal. I-AMD isebenzise uyilo olucwangcisiweyo lwe-chip ezininzi ngo-2017; kwiminyaka emibini kamva, wonke umntu waqhelana nento yokuba kwakungekho typo kwigama elithi "chiplet".
Kwixesha elizayo, njengoko isilayidi senkcazo-ntetho sichaza, i-AMD iya kutshintshela kuyilo oluxutyiweyo oluya kudibanisa i-2,5D kunye ne-3D element. Lo mzekeliso unika umbono ombi weempawu zeli lungiselelo, kodwa embindini unokubona iikristale ezine ezibekwe kwinqwelomoya enye, zingqongwe ziinkumbulo ezine ze-HBM zesizukulwana esihambelanayo. Kubonakala ukuba, ukuyila kwe-substrate eqhelekileyo kuya kuba nzima ngakumbi. I-AMD ilindele ukuba uguqulo kolu yilo luyakwandisa ukuxinana kojongano lweprofayile kalishumi. Kusengqiqweni ukucinga ukuba ii-GPU zeseva ziya kuba phakathi kwabokuqala ukwamkela olu lungiselelo.
umthombo: 3dnews.ru