IHuawei, i-Samsung kunye ne-Qualcomm sele ibonise ii-chipsets ezixhasa iimodem ze-5G. Imithombo yenethiwekhi ithi iMediaTek kungekudala iza kulandela. Inkampani yaseTaiwan ibhengeze ukuba inkqubo entsha ye-single-chip enenkxaso ye-5G iya kuboniswa ngoMeyi ka-2019. Oku kuthetha ukuba umenzi uneentsuku ezimbalwa ezishiyekileyo ukuba abonise uphuhliso lwayo.
Imodem ye-Helio M70 yaqala ibekwe yiMediaTek njengeqonga lokudala izixhobo ezixhasa i-5G. Imveliso ayikaveliswa ngobuninzi kwaye ayibonelelwanga kubavelisi bokwenyani be-smartphone.
Ayaziwa ukuba i-chipset entsha iya kuba nemodem edibeneyo ye-5G. Kungenzeka ukuba umcimbi weMediaTek uya kunikezelwa ekuboniseni imodem yeHelio M70. Kuhlala kungacacanga ukuba ii-smartphones zokuqala zixhotyiswe nge-chipset entsha yeMediaTek ekwaziyo ukusebenza kuthungelwano lonxibelelwano lwesizukulwana sesihlanu zinokuvela kwintengiso.
Ukusuka kumyalezo weMediaTek, kuyacaca ukuba i-chipset entsha ye-5G ixhasa itekhnoloji yobukrelekrele bokwenziwa. Mhlawumbi sithetha ngeteknoloji ye-AI Fusion, esetyenziselwa ukusasaza imisebenzi phakathi kwe-APU kunye neeprosesa zemifanekiso. Le ndlela inokunyusa kakhulu isantya sokwenziwa kweenkqubo ezinxulumene ne-AI. Le teknoloji sele isetyenziswe kwi-chip ye-Helio P90, eveliswa ngokusebenzisa inkqubo ye-nanometer ye-12.
Iinkcukacha malunga ne-chipset entsha yeMediaTek enenkxaso ye-5G iya kubhengezwa kwiintsuku ezimbalwa ezizayo.
umthombo: 3dnews.ru