I-AMD iza kubonisa iiprosesa zayo ezintsha ze-Ryzen 2019 ngeveki kwi-Computex 3000, kwaye abavelisi bebhodi yomama baya kubonisa iimveliso zabo kwezi processors ngokusekwe kwi-chipset entsha ye-AMD X570 kumboniso ofanayo. Kwaye ngokwesiko, ngenxa yesixhobo seVideoCardz, sinokujonga ezinye iibhodi nangaphambi kokubhengezwa. Ngeli xesha imifanekiso yeebhodi ezimbini zeMPG zapapashwa.
Njengoko usazi, uthotho lweMPG, olwaziswa kulo nyaka uphelileyo, ludibanisa iibhodi zomama ezikwinqanaba eliphakathi. Iimodeli eziphambili kakhulu ziqokelelwa kuluhlu lwe-MEG, kwaye iibhodi ze-motherboard ezilula kunye nezona zifikelelekayo zibandakanyiwe kwi-MAG series. Okunokwenzeka, ulwahlulo olufanayo luya kusetyenziswa kwiibhodi ze-X570 ezintsha, ngoko ke i-MPG X570 Gaming Plus kunye ne-MPG X570 Pro Carbon imodeli eboniswe kwimifanekiso iya kuba yibhodi ephakathi.
Into yokuqala ebamba iliso lakho kwimifanekiso nganye yeemveliso ezintsha yinkqubo yokupholisa i-chipset, engabandakanyi nje i-radiator, kodwa kunye ne-fan enkulu. Esi sesinye isiqinisekiso sokuba i-X570 yenkqubo ye-logic esuka kwi-AMD yajika yaba "shushu" kakhulu. Ngaphambili, ulwazi luye lwavela kwi-Intanethi ukuba amandla asetyenziswayo kule chipset yi-15 W, ngelixa uninzi lwenkqubo yedesktop ye-logic yanamhlanje eli nani alidluli kwi-5-7 W. Nale X470 yangoku ineTDP ye-6,8 W.
Kungenjalo, iMPG X570 Gaming Plus kunye neMPG X570 Pro Carbon motherboards zikhangeleka ziqhelekile. Sinokuqaphela ii-subsystems zamandla ezinkulu ezineradiyetha ezinkulu kakhulu kuzo. Ibhodi nganye ine-slots ezimbini ze-PCIe 4.0 x16, kunye ne-slots ezimbini ze-M.2, kwaye kwimeko ye-Pro Carbon model, zixhotyiswe nge-heatsinks. Le bhodi ikwabonisa ukukhanya kwe-RGB enokwenziwa ngokwezifiso. Ngelishwa, iinkcukacha ezipheleleyo zeemveliso ze-MSI MPG zeemveliso azikachazwanga.
umthombo: 3dnews.ru