I-assortment yayo nayiphi na inkampani eyaziwayo eyenza ii-motherboards namhlanje iquka iimodeli ezininzi ezixhasa imisebenzi yokugqithisa. Endaweni ethile - umzekelo, kwi-elite ASUS ROG uchungechunge - kukho inani elingapheliyo lemisebenzi enjalo, njengokuba kukho ezinye ezininzi, kodwa kwiinguqulelo ezifikelelekayo zeebhodi, ngokuchaseneyo, abaphuhlisi bongeze kuphela i-overclocking esisiseko. izakhono. Kodwa kukho udidi oluncinci kakhulu lweebhodi zebhodi ezilungiselelwe ngokukodwa ukugqithisa. Abaxhatshazwanga ngabalawuli "abanobunzima" bokujikeleza, kaninzi abaxhasi ubuninzi be-RAM kwiseti ethile yeengcamango, kwaye abakhanyiswa "ikhaphethi" eqhubekayo ye-LED kwi-PCB. Kodwa bakulungele ukucudisa yonke ijusi ngaphandle kweeprosesa kwaye zenzelwe ukufikelela kumaza obuninzi kunye nokuseta iirekhodi.
Enye yezi bhodi yakhululwa ngaphezulu konyaka odlulileyo ngu-ASRock ngokuthatha inxaxheba ngokuthe ngqo kwentsomi yaseTaiwan uNick Shih. Ubambe kwaye usabambe iirekhodi ezininzi zeprosesa ezigqithisiweyo zisebenzisa i-nitrogen engamanzi, kwaye phakathi kwee-overclockers zobuchwephesha wabamba indawo yokuqala kwiinyanga ezili-18. Yayizingcebiso zakhe eziye zanceda abaphuhlisi ukuba bakhulule iFomula ye-ASRock X299 OC, kwaye yayiziiprofayili zakhe ezigqithileyo ezithe zafakwa kwi-BIOS yale bhodi.
Namhlanje siza kuqhelana neempawu zale bhodi kwaye sifunde amandla ayo okugqithisa.
Iimpawu zobugcisa kunye neendleko
| ASRock X299 OC Ifomu | |
| Iiprosesa ezixhaswayo | Iiprosesa ze-Intel Core X kwi-LGA2066 version (isizukulwana sesixhenxe se-Core microarchitecture); inkxaso yeTurbo Boost Max Technology 3.0; Ixhasa iteknoloji ye-ASRock Hyper BCLK Engine III |
| Chipset | I-Intel X299 Express |
| Inkqubo engaphantsi kweMemori | I-4 × i-DIMM DDR4 imemori engaguqukiyo ukuya kuthi ga kwi-64 GB; imowudi yememori yesine okanye ezimbini (kuxhomekeke kwiprosesa); inkxaso iimodyuli kunye frequency 4600(OC)/4500(OC)/4400(OC)/4266(OC)/4133(OC)/4000(OC)/ 3866(OC)/3800(OC)/3733(OC)/3600(OC)/3200(OC)/2933(OC)/2800(OC)/2666(OC)/2400(OC)/ 2133 MHz; I-15-μm yoqhagamshelwano olufakwe ngegolide kwiindawo zokubeka imemori; I-Intel XMP (iProfayili yeMemori egqithisileyo) inkxaso ye-2.0 |
| Izidibanisi zamakhadi okwandisa | 5 PCI Express x16 3.0 kwiindawo zokubeka, x16/x0/x0/x16/x8 okanye x8/x8/x8/x8/x8 iindlela zokusebenza kunye iprosesa kunye 44 PCI-E imizila; x16/x0/x0/x8/x4 okanye x8/x8/x0/x8/x4 eneprosesa enemizila engama-28 yePCI-E; x16/x0/x0/x0/x4 okanye x8/x0/x0/x8/x4 eneprosesa enemizila ye-PCI-E eyi-16; 1 PCI Express 3.0 x4 slot; 1 PCI Express 2.0 x1 slot; I-15-μm yoqhagamshelwano ngegolide efakwe kwi-PCI-E1 kunye ne-PCI-E5 slots |
| Inkqubo esezantsi yeVidiyo scalability | I-NVIDIA Quad/4-way/3-way/2-way SLI Technology; AMD Quad/4-way/3-way/2-way CrossFireX Technology |
| Qhuba ujongano | Intel X299 Express Chipset: - 6 × SATA 3, i-bandwidth ukuya kwi-6 Gbit / s (ixhasa i-RAID 0, i-RAID 1, i-RAID 5, i-RAID 10, i-Intel Optane Memory, i-Intel Rapid Storage 15, i-Intel Smart Response, i-NCQ, i-AHCI kunye ne-Hot Plug); - 2 × Ultra M.2 (PCI Express x4 Gen 3 / SATA 3), i-bandwidth ukuya kwi-32 Gb / s (zombini izibuko zokuxhasa iintlobo ze-drive 2230/2242/2260/2280/22110). Umlawuli we-ASMedia ASM1061: -I-2 × SATA 3, i-bandwidth ukuya kwi-6 Gbit / s (ixhasa i-NCQ, i-AHCI kunye ne-Hot Plug) |
| Inethiwekhi ujongano |
Abalawuli ababini be-Intel Gigabit LAN network I219V kunye ne-I211AT (10/100/1000 Mbit); ukukhuselwa kumbane kunye nokukhutshwa kwe-electrostatic (uMbane / uKhuseleko lwe-ESD); inkxaso ye-Wake-On-LAN, i-LAN ezimbini kunye neTekhnoloji yeQela; ukonga amandla Ethernet 802.3az, PXE umgangatho |
| Wireless network interface | Akakho |
| Bluetooth | Akakho |
| Inkqubo esezantsi yomsindo | I-Realtek ALC7.1 1220-channel HD codec: - i-signal-to-noise ratio kwi-audio ye-audio ye-linear yi-120 dB, kunye ne-input input - 113 dB; -I-audio capacitors zaseJapan iNichicon Fine Gold Series; -I-headphone yeamplifier eyakhelwe-ngaphakathi ye-TI NE5532 Premium enemveliso kwipaneli yangaphambili (ixhasa ii-headphones kunye ne-impedance ukuya kwi-600 Ohms); -ukwahlulwa kwendawo yomsindo kwibhodi yePCB; - iziteshi zomsindo ezisekhohlo nasekunene zikwimaleko ahlukeneyo ebhodi yesekethe eprintiweyo; – ukhuseleko ekunyukeni kwamandla; – 15-μm izidibanisi zokumamela ezifakwe ngegolide; -Inkxaso yomsindo wePremium Blu-ray; -inkxaso yoKhuseleko lweSurgery kunye neTekhnoloji ye-Purity Sound 4; – DTS Qhagamshela inkxaso |
| Ujongano lwe-USB | Intel X299 Express Chipset: - I-6 USB 3.1 Gen1 izibuko (4 kwipaneli yangasemva, i-2 iqhagamshelwe kwikhonkco ebhodini); - I-6 USB 2.0 izibuko (i-2 kwiphaneli yangasemva, i-4 ixhunywe kwizixhumi ezimbini ebhodini). Umlawuli we-ASMedia ASM3142: – 2 USB 3.1 Gen2 izibuko (Uhlobo-A kunye ne-C kwiphaneli yangasemva); Umlawuli we-ASMedia ASM3142: -I-1 USB 3.1 Gen2 port (Uhlobo-C lwephaneli yangaphambili yecala) |
| Izihlanganisi kunye namaqhosha kwipaneli yangasemva | I-2 USB 2.0 izibuko kunye ne-PS / 2 i-combo port; iqhosha le-BIOS Flashback; Coca iqhosha le-CMOS; 2 USB 3.1 Gen1 izibuko; I-2 USB 3.1 Gen1 izibuko kunye ne-RJ-45 LAN socket; I-2 USB 3.1 Gen2 izibuko (Uhlobo-A + Uhlobo-C) kunye ne-RJ-45 LAN socket; imveliso ye-S/PDIF yokubona; Iijekhi zeaudio ezi-5 (Isithethi sangasemva / uMbindi / iBass / Umgca ngaphakathi / iSithethi sangaphambili / imakrofoni) |
| Izihlanganisi zangaphakathi kwibhodi yesistim | I-EATX ye-24-pin yokudibanisa amandla aphezulu; I-8-pin high-density ATX 12V isidibanisi samandla; I-4-pin high-density ATX 12V isidibanisi samandla; I-6-pin high-density ATX 12V isidibanisi samandla samakhadi evidiyo; 8 SATA 3; 2 M.2; Iintloko ezi-5 ze-4 ze-case / abalandeli beprosesa ngenkxaso ye-PWM; Izixhumi ze-LED ze-2 RGB; USB 3.1 Gen1 isinxibelelanisi sokudibanisa amazibuko amabini; I-2 USB 2.0 izihlanganisi zokudibanisa izibuko ezine; USB 3.1 Gen2 isinxibelelanisi kwizibuko kwiphaneli yangaphambili yecala; TPM isinxibelelanisi; ijekhi yomsindo yephaneli yangaphambili; Isidibanisi somsindo seEngile yasekunene; I-RAID ebonakalayo Kwi-CPU isinxibelelanisi; I-LED yamandla kunye nezixhumi zeSithethi; Isidibanisi seNdudumo; iqela leekhonkco zepaneli yangaphambili; Isidibanisi soLawulo lombane; Iimpawu zikaGqr ukulungisa ingxaki; Iqhosha lamandla elikhanyayo; phinda umisele iqhosha; iqhosha lokuphinda uqalise (Zama kwakhona); iqhosha le-Safe Boot; amaqhosha e-OC akhawulezayo; iqhosha lemenyu; PCIe ON/OFF iiswitshi; Umhloli weSimo sePosi (PSC); iswitsha yeMowudi ecothayo; Ukutshintsha imo ye-LN2; BIOS B Khetha isinxibelelanisi |
| BIOS | I-2 × 128 Mbit AMI UEFI BIOS enegobolondo lomzobo weelwimi ezininzi (SD/HD/Full HD); I-PnP, inkxaso ye-DMI 3.0; WfM 2.0, SM BIOS 3.0, ACPI 6.1; inkxaso yeTekhnoloji ye-UEFI eKhuselekileyo |
| Iimpawu zoMsayino, iiTekhnoloji kunye neempawu ezikhethekileyo | OC Formula Power Kit: – Isigaba se-13 soyilo lwaMandla e-CPU + uyilo lweSigaba esi-2 seMemori; – Amandla eDigi (CPU kunye neMemori); –uGqr. MOS; IKhithi yoQhagamshelwano lweFomula ye-OC: – Hi-Density Power Connector (24-pin for Motherboard, 8+4 pin for Motherboard, 6-pin for PCIe Slot); – 15μ Uqhagamshelwano lweGolide (iziseko zememori kunye nePCIE x16 slots (PCIE1 kunye nePCIE5)); Ikhithi yokuPholisa yeFormula ye-OC: – 8 Layer PCB; – 2oz ubhedu; – Uyilo lwemibhobho yoBushushu; IKhithi yeFomula ye-OC yokuJonga: -Isivamvo se-Thermal esininzi I-ASRock Super Alloy: -iradiyetha ye-aluminium XXL; -I-Premium 60A Ukuxhuzulwa kwamandla; – 60A Dr.MOS; -i-premium memory capacitors; – Nichicon 12K Black capacitors (100% umgangatho ophezulu kunye conductivity polymer capacitors ezenziwe eJapan); - ibhodi yesekethe emnyama eprintiweyo; -Ilaphu leglasi eliXina kakhulu kwiPCB; ASRock Steel Slots; I-ASRock Ultra M.2 (PCIe Gen3 x4 & SATA3); Amandla e-ASRock Ultra USB; I-ASRock yoKhuseleko olupheleleyo lwe-Spike (kuzo zonke i-USB, i-Audio kunye ne-LAN izixhumi); Uhlaziyo olubukhoma lwe-ASRock kunye nevenkile ye-APP |
| kwinkqubo yokusebenza | Microsoft Windows 10 x64 |
| Umba wefomu, imilinganiselo (mm) | ATX, 305×244 |
| Isiqinisekiso umenzi, iminyaka | 3 |
| Ubuncinci bexabiso lokuthengisa, i-rub. | 30 700 |
Ukupakisha kunye nokupakishwa
Ifomula ye-ASRock X299 OC iza kwibhokisi enkulu, ehonjiswe kwisikimu sombala esingqongqo. Akukho zikhuseli eziqaqambileyo, ezitsala amehlo okanye izitikha kwicala langaphambili - kuphela igama lebhodi, umenzi kunye noluhlu lwetekhnoloji exhaswayo.
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Ngasemva kwebhokisi unokufumana uluhlu olufutshane lweempawu zebhodi kunye namazibuko ayo kwipaneli yangasemva, kunye nolwazi olupheleleyo olupheleleyo lutyhilwa phantsi kwepaneli engaphambili yebhokisi.
Apha unokufumana phantse lonke ulwazi malunga nemveliso, kwaye ubone uninzi lwebhodi ngefestile yeplastiki ecacileyo.
Isincamathelisi esisekupheleni kwebhokisi sibonisa inombolo yothotho kunye nenombolo yebhetshi, igama lemodeli yebhodi kunye nemilinganiselo yayo, ilizwe lemveliso kunye nobunzima.
Nceda uqaphele ukuba ibhodi inobunzima obungaphezu kwe-1,2 kilograms, ngokwenene inkulu kakhulu kwaye inzima.
Ngaphakathi kwebhokisi lekhadibhodi, ibhodi ilele kwi-tray ye-polyethylene ye-foam, apho icinezelwe ngezibophelelo zeplastiki, kunye nenye ifake eyenziwe yinto efanayo igubungela phezulu.
Iphakheji yokuhanjiswa kwebhodi ibandakanya iintambo ezine ze-SATA ezineentambo, i-backplate esemgangathweni, ipaneli yangasemva engenanto, izikrufu ezimbini zokukhusela ii-drives kwiindawo zokubeka i-M.2, kunye neebhuloho ezine zokudibanisa zokulungiselela ukucwangciswa kwe-SLI eyahlukeneyo.
Ukusuka kumaxwebhu, ibhodi iza neentlobo ezimbini zemiyalelo equlathe amacandelo ngesiRashiya, iphecana kwiiprosesa ezixhaswayo, ikhadi leposi le-ASRock, idiski enabaqhubi kunye nezinto eziluncedo zobunikazi.
Ifomula ye-ASRock X299 OC iza newaranti yeminyaka emithathu. Ngokuphathelele iindleko, eRashiya ibhodi ingathengwa ngexabiso le-30,7 lamawaka eeruble. Ngamanye amazwi, le yenye yeebhodi zemotherboard ezibiza kakhulu kwi-LGA2066 processors.
Impawu zoyilo
Uyilo lweFormula ye-ASRock X299 OC ingqongqo, kodwa kwangaxeshanye inomtsalane. Isicwangciso sombala webhodi sikhethwe ngendlela yokuba zonke izinto zayo, kubandakanywa ii-radiator, zidibaniswe ngokuhambelanayo. Ke ngoko, xa uyijongile, ufumana imvakalelo yemveliso enzulu kunye nekumgangatho ophezulu, hayi enye ibhodi "yethoyizi" enezixhobo ezincinci ezikhanyayo kwiPCB.
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Ndingathanda ngakumbi ukuqaphela iiradiyetha ezinkulu zokupholisa iisekethe zeVRM zeprosesa, eziqhagamshelwe ngumbhobho wobushushu. I-chipset heatsink, apho igama lemodeli yebhodi liprintwe, nayo yenziwe ngendlela efanayo.
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Masiyongeze ukuba i-ASRock X299 OC Formula yenziwe kwifom ye-ATX kwaye inemilinganiselo ye-305 × 244 mm.
Indawo ebalulekileyo yepaneli yangasemva yebhodi ihlala ekupheleni kweembambo zecandelo lesibini le-radiator. Ngokucacileyo, ngesisombululo esilula ngolo hlobo, abaphuhlisi bafuna ukwandisa ukusebenza kakuhle kokupholisa kwezinto zeVRM. Iinkcazo zebhodi zichaza ukuba le heatsink iyakwazi ukususa ukuya kuthi ga kwi-450 watts yamandla obushushu kwizinto zeVRM.
Nangona le nyaniso, zonke izibuko eziyimfuneko zifumaneka kwipaneli yangasemva. Phakathi kwazo kukho i-USB esibhozo, kuquka i-3.1 Gen2, i-PS / 2 port, i-BIOS Flashback kunye namaqhosha e-CMOS acacileyo, ii-outlet zamandla amabini, i-optical output kunye ne-5 ye-audio output. Iplagi ayakhelwanga apha, njengakwezinye iibhodi zeflegi.
Ekuphela kwezincamatheliso kwiFomula ye-ASRock X299 OC ziiradiyetha, akukho zigqubuthelo zeplastiki ezikhanyiswe ngasemva. I-radiators ikhuselekile nge-screws, ngoko inokususwa ngaphandle kobunzima obuninzi. Yile nto ibhodi ibonakala ngayo ngaphandle kwabo.
Njengezinye iibhodi ze-ASRock zeflagship, iX299 OC Formula isebenzisa i-PCB enemigangatho esibhozo yoxinaniso, ekwaziyo ukumelana nokuguquguquka kwamandla ombane kunye nokufuma okuphezulu. Ukongezelela, iphinda kabini ubukhulu bemigangatho yobhedu, okufuneka ibe nefuthe elihle ekusasazeni ukushisa.
Iinzuzo eziphambili zebhodi ye-ASRock, esiza kuxubusha kuyo yonke inqaku, inikwe ngezantsi.
Umzobo onetheyibhile osuka kwimiyalelo yokusebenza uya kukunceda ufunde ngokweenkcukacha ngakumbi ulungiselelo lwezinto kwi-PCB.
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Kwisiseko seprosesa ye-LGA2066 yebhodi yeFomula ye-ASRock X299 OC, iinaliti zoqhagamshelwano zifakwe kwi-15-μm yegolide. Ngokutsho kwabaphuhlisi, le ngubo inceda ukunyusa ukuchasana kweenaliti kwi-corrosion kwaye yandisa inani lamaxesha apho iprosesa inokususwa kwaye ifakwe ngaphandle koqhagamshelwano olubi kunye nayo (ebaluleke kakhulu kwii-overclockers). Ukongeza, embindini wekhonkco kukho umngxuma wokufaka inzwa ye-thermal phantsi kweprosesa.
Okwangoku, ibhodi ixhasa iimodeli ezili-17 zeeprosesa ze-Intel ezikhutshwe kuyilo lwe-LGA2066.
Kuchazwa ukuba i-processor power circuit yakhiwe ngokwesiphaluka se-13-phase, apho kusetyenziswa iindibano zikaDkt. MOS, Premium 60A Power Choke kunye Nichicon 12K Long Life Capacitors. Amandla ewonke esekethe yamandla eprosesa abekwe kwi-750 A.
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Kodwa xa kuhlolisiswa ngokusondeleyo, kuvela ukuba izigaba ezili-12 zabelwe ngokuthe ngqo kwiprosesa, kwaye enye ibandakanyeka kwi-VCCSA (i-right choke kwisithombe esibhalwe TR30) kunye ne-VCCIO. Ngasemva kwe-PCB kukho i-microcircuits yokugcina i-backup, ukusetyenziswa kwayo kuboniswa ngokusetyenziswa kwesilawuli se-ISL69138 sesigaba sesixhenxe.
Ukongeza, i-ASRock X299 OC Formula inejenereyitha yewotshi yangaphandle - Hyper BCLK Engine III, ephunyezwe yi-ICS 6V41742B microprocessor.
Kufuneka incede ukufezekisa iziphumo ezingaphezulu kwe-overclocking ye-BCLK frequency kunye nokubonelela ngokuchaneka okwandisiweyo kokucwangcisa kwayo.
Ukubonelela ngamandla, ibhodi yayixhotyiswe ngeziqhagamshelo ezine. Ezi ziquka umgangatho we-24 kunye ne-8-pin, kunye ne-4-pin eyongezelelweyo yeprosesa kunye nememori. Ewe, kukho isidibaniso se-pin-pin ekufuneka siqhagamshelwe ukuba amakhadi evidiyo amane afakwe ebhodini kanye.
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Zonke iziqhagamshelo zamandla ebhodini zisebenzisa iinaliti zoqhagamshelwano oluphezulu.
Inani le-RAM slots kwibhodi yeFomula ye-ASRock X299 OC iye yancitshiswa ukusuka kwisibhozo ukuya kwezine, kwaye ubuninzi bememori ye-DDR4 exhaswayo iye yancitshiswa ukusuka kwi-128 ukuya kwi-64 GB. Le ndlela yeenjineli ze-ASRock iyaqondakala kwaye iyathetheleleka, kuba ii-overulsers kwiiplatifomu ezine-LGA2066 azifane zisebenzise zonke iindawo zokubeka ezisibhozo, kwaye kulula kakhulu ukufezekisa ukugqithiswa kwememori okuchukumisayo ukusuka kwiimodyuli ezine kunesibhozo. Iindawo zokubeka zibekwe ngababini kumacala omabini eprosesa yeprosesa, bonke abafowunelwa ngaphakathi kubo bagqunywe ngomqolo wegolide we-15 μm.
Ukuphindaphinda kweemodyuli kunokufikelela kwi-4600 MHz, kunye nenkxaso ye-XMP (iProfayili yeMemori ePhambili) umgangatho we-2.0 uya kwenza ukufezekisa lo mfanekiso kube lula njengoko kunokwenzeka, ekubeni iikiti ze-DDR4 ezine-frequency nominal frequency zingathengwa. Ngendlela, iwebhusayithi yenkampani ipapashe uluhlu lweekiti ze-RAM eziqinisekisiweyo kule bhodi, phakathi kwayo imemori ene-frequency ye-4600 MHz (G.Skill F4-4600CL19D-16GTZKKC). Masidibanise ukuba inkqubo yonikezelo lwamandla kwipere nganye yeendawo zokubeka inamajelo amabini.
Kukho iindawo zokubeka ezisixhenxe zePCI Express kwifomula ye-ASRock X299 OC, kwaye ezintlanu kuzo, ezenziwe kwifomu ye-x16, zineqokobhe lentsimbi elomeleza ngakumbi ezi ndawo zokubeka kwaye likhusela abafowunelwa babo kwimitha ye-electromagnetic. Ukongeza, kwindawo yokuqala neyesihlanu, abafowunelwa ngaphakathi nabo bafakwe ngegolide kunye ne-15 microns.
Xa iprosesa enemizila engama-44 yePCI-E ifakwe ebhodini, ixhasa ukuyilwa kolungelelwaniso lwemizobo emininzi ukusuka kumakhadi evidiyo amane kwi-AMD okanye kwi-NVIDIA GPUs kwimowudi ye-x8/x8/x8/x8, kwaye amakhadi amabini evidiyo aya kusebenza isantya esipheleleyo x16/x16 indibaniselwano. Ngokwahlukileyo, ngeprosesa enemizila engama-28 ye-PCI-E, kuyenzeka ukuba usebenzise amakhadi evidiyo amane kwi-AMD GPU kwimowudi ye-x8/x8/x8/x4 okanye ezintathu kwi-NVIDIA GPU kwimowudi ye-x8/x8/x8, kunye nezimbini. Amakhadi evidiyo aya kuhlala esebenza kwimowudi ye-x16 /x8. Ekugqibeleni, xa ufaka iprosesa enemizila ye-PCI-E ye-16 ebhodini, iindlela ze-x16 okanye x8/x8 ziya kufumaneka.
Uluhlu olukhulu lwee-multiplexers ezenziwe yi-NXP (iziqwenga ezingama-22), ezinye zazo zibekwe ngasemva kwe-PCB, zinoxanduva lokusasazwa kwemigca ye-PCI-E ebhodini.
Ukongeza, umlawuli we-ASM1184e owenziwe ngu-ASMedia utshintsha imigca ye-PCI-Express.
Kuba peripherals, ibhodi enye PCI Express 3.0 x4 slot enesiphelo esivulekileyo kunye PCI Express 2.0 x1 slot enye.
I-chip ye-Intel X299 Express chipset inxibelelana ne-heatsink ngephedi ye-thermal kwaye ayibonakali kuyo nayiphi na into ekhethekileyo.
Ngaba kunokwenzeka ukuba uqaphele ukuba kwi-PCB yebhodi, ngokuchanekileyo ujikeleze umjikelezo we-chipset heatsink, ii-LED ezili-19 ze-RGB zinengcingo.
Ibhodi ixhotyiswe ngee-SATA ezisibhozo ze-3 izibuko, ezintandathu kuzo ziphunyezwe ngokusebenzisa ubuchule be-Intel X299 Express chipset. Baxhasa ukudalwa kwe-RAID yoluhlu lwamanqanaba 0, 1, 5 kunye ne-10, kunye ne-Intel Optane Memory, i-Intel Rapid Storage 15, i-Intel Smart Response, i-NCQ, i-AHCI kunye ne-Hot Plug teknoloji.
Izibuko ezimbini ezongezelelweyo ziphunyezwa ngumlawuli we-ASMedia ASM1061. Intsingiselo yobukho babo ebhodini ejoliswe ekugqithiseni i-overclocking ayicacanga kuthi.
I-ASRock X299 OC Formula ixhotyiswe ngamachweba amabini e-Ultra M.2 kunye ne-throughput ukuya kwi-32 Gbps, zombini ezixhasa ukuqhubela phambili kunye ne-PCI Express x4 Gen 3 kunye ne-SATA 3 ujongano.
Ubude bokuqhuba kuzo zombini izibuko kunokuba nayiphi na (ukusuka kwi-30 ukuya kwi-110 mm), kodwa i-drawback apha icacile - akukho zixhobo ze-radiator njengeklasi, nangona ingxaki yokufudumala kwe-SSDs kunye nokunciphisa okubangelwa kwi-radiator yabo. ukusebenza kuhle kakhulu namhlanje.
Ukuqhubela phambili isihloko sokuqhuba, siqaphela ubukho be-RAID ebonakalayo kwi-CPU isixhumi (VROC1) ebhodini.
Yenzelwe ukwenza uluhlu olukhawulezayo lwe-RAID ukusuka kwi-NVMe SSDs eqhagamshelwe ngokuthe ngqo kwiprosesa.
Kukho amazibuko ali-15 e-USB ebhodini - ezisibhozo zangaphandle kunye nesixhenxe sangaphakathi. Amazibuko amathandathu yi-USB 3.1 Gen1: ezine zibekwe kwipaneli yangasemva kwaye ezimbini ziqhagamshelwe kwikhonkco yangaphakathi ebhodini. Amazibuko amathandathu angaphezulu akwinqanaba le-USB 2.0: ezimbini zibekwe kwipaneli yangasemva kwaye ezine ziqhagamshelwe kwizixhumi ezimbini zangaphakathi ebhodini.
Zonke izibuko ezidwelisiweyo ziphunyezwa ngamakhono e-chipset. Abalawuli ababini abongezelelweyo be-ASMedia ASM3142 benze ukuba bakwazi ukongeza izibuko ezintathu ze-USB 3.1 Gen2 ezinesantya esiphezulu kunye ne-bandwidth ukuya kwi-10 Gbps.
Amazibuko amabini anjalo anokufumaneka kwiphaneli yangasemva (uHlobo-A kunye nezihlanganisi ze-C), kwaye elinye izibuko libekwe kwi-PCB kwaye lijoliswe ekudibaniseni intambo kuyo ukusuka kwiphaneli yangaphambili yecala leyunithi yenkqubo. Ngokubanzi, inani leezibuko ze-USB kunye nokuhanjiswa kwazo kwi-ASRock X299 OC Formula inokubizwa ngokuba ilungile.
Ibhodi yayixhotyiswe ngabalawuli benethiwekhi yegigabit ezimbini: Intel WGI219-V kunye ne-Intel WGI211-AT.
Bobabini abalawuli kunye neziqhagamshelo zabo zikhuselwe ekukhanyeni kombane kunye nokukhutshwa kwe-electrostatic (UkuKhanya / ukuKhuselwa kwe-ESD), kunye nokuxhasa i-Wake-On-LAN, i-Dual LAN kunye ne-Teaming technologies kunye nomgangatho wokulondoloza amandla we-Ethernet 802.3az.
Ngaphandle kokulungelelaniswa okucacileyo kwe-ASRock X299 OC Formula, ingqalelo efanelekileyo ihlawulwe kwisandi. Umendo weaudio usekwe kwi-codec ye-audio ye-7.1-channel ye-Realtek ALC1220 eyaziwayo.
Ukuphucula ukucoceka kwesandi, yongezwa ngeJapan Nichicon Fine Gold Series audio capacitors kunye ne-TI NE5532 Premium headphone amplifier kunye nesiphumo sepaneli yangaphambili (ixhasa ii-headphones kunye ne-impedance ukuya kwi-600 Ohms).
Ukongeza, iziteshi zomsindo ezisekhohlo nasekunene zikwimaleko ahlukeneyo ePCB, kwaye yonke indawo yecandelo lomsindo yahlulwe kuyo yonke ibhodi ngamacu angasebenziyo.
Ukulungiswa kwe-hardware enjalo, ngokutsho kwabaphuhlisi, kwenza ukuba kube lula ukuphumeza umlinganiselo wesignali-kwingxolo kwi-audio ye-audio ye-120 dB, kunye ne-input input - 113 dB. Kwinqanaba le-software, zincediswa yi-Purity Sound 4, i-DTS Connect, i-Premium Blu-ray audio, i-Surgery Protection kunye ne-DTS Connect teknoloji.
Imisebenzi yokubeka iliso kunye nokulawula abalandeli ebhodini inikwe abalawuli ababini be-Super I / O Nuvoton NCT6683D kunye ne-NCT6791D.
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Ukongeza, abalawuli ababini abongezelelweyo beWinbond W83795ADG bathengiswa kwicala elingasemva lebhodi.
Umlawuli ngamnye onjalo unokubeka esweni ukuya kuthi ga kwi-voltages ye-21, abalandeli be-8 kunye neenzwa ze-6 zeqondo lokushisa. Kodwa kuyamangalisa ukuba ebhodini sinokufumana kuphela izixhumi ezi-5 zokudibanisa nokulawula abalandeli nge-PWM okanye i-voltage. Ngokombono wethu, kwi-motherboard yale klasi kunye nokuqhelaniswa kufuneka kubekho ubuncinane ezisixhenxe kwezi zixhumi.
Kodwa ibhodi ixhotyiswe ngeseti ebanzi yamaqhosha okugqithisa kunye nokutshintsha, kunye nee-LED ezine zokuxilonga.
Ukongezelela, kumda ongezantsi we-PCB kukho isalathisi sekhowudi ye-POST, apho unokugqiba isizathu sephutha xa ulayisha okanye ukungaphumeleli kwenkqubo.
I-ASRock X299 OC Formula iqulethe iitshiphusi ezimbini ze-BIOS ze-128-bit.
Ukutshintsha phakathi kwe-microcircuits ephambili kunye ne-backup iphunyezwa ngokusebenzisa i-jumper endala. Masiyongeze ukuba iqhosha le-BIOS Flashback kwiphaneli yangasemva yebhodi ingasetyenziselwa ukuhlaziya i-BIOS. Ngaphezu koko, oku akufuni iprosesa, i-RAM, okanye ikhadi levidiyo - kuphela ibhodi ngokwayo enamandla adibeneyo, i-USB drive kunye nenkqubo yefayile ye-FAT32 kunye nenguqu entsha ye-BIOS.
Njengoko sichazile ngasentla, indawo ye-chipset heatsink ebhodini igxininisiwe. Umbala we-backlight kunye nemowudi yokusebenza inokuqwalaselwa zombini kwi-BIOS nakwi-ASRock RGB ye-LED ye-proprietary application.
Izixhumi ezimbini ze-RGB ziya kunceda ukwandisa i-backlight kuwo wonke umzimba weyunithi yenkqubo, apho unokudibanisa khona imichilo ye-LED kunye nomda wangoku we-3 A nganye kunye nobude ukuya kwiimitha ezimbini.
Ukupholisa kwezinto zesekethe ye-VRM kwi-ASRock X299 OC Formula iphunyezwa ziiradiyetha ezimbini ezinkulu ezidityaniswe ngumbhobho wobushushu. Irediyetha ekude ngokuyinxenye yolulela kwiphaneli yangasemva yebhodi kwaye iphinda ipholiswe kukuhamba komoya kwangaphandle.
I-chipset, engafudumezi kakhulu, ine-heatsink ethe tyaba ye-aluminium ene-thermal pad.
umthombo: 3dnews.ru