Isebe lezoRhwebo lase-US libhengeze ngoLwesihlanu ukwandiswa kweLayisensi Jikelele yeXeshana, evumela iinkampani zase-US ukuba zenze utshintshiselwano oluthile kunye neHuawei Technologies ngeentsuku ezongezelelweyo ze-90, nangona kuluhlu lwabamnyama.
Kwangaxeshanye, ulawulo lukaTrump luye lwafudukela ekuthinteleni unikezelo lwee-semiconductors kwiHuawei ukusuka kubavelisi be-chip behlabathi, nto leyo inokukhokelela ekwandeni koxinzelelo kubudlelwane base-US neTshayina.
Isebe lezoRhwebo laseMelika namhlanje libhengeze utshintsho kwimimiselo yokuthumela ngaphandle ngokugxila kwiqhinga kwiHuawei "ukufumana i-semiconductors eyimveliso ngokuthe ngqo yesoftware ethile yase-US kunye nobuchwepheshe." Ngokutsho kwesebe, oku kuya kuzichasa iinzame zikaHuawei zokuthintela ulawulo lokuthumela ngaphandle kwe-US.
ISebe lezoRhwebo liqaphele ukuba iHuawei iyaqhubeka nokusebenzisa isoftware yase-US kunye netekhnoloji ukuphuhlisa i-semiconductors nangona ifakwe kuluhlu olumnyama.
Ngaphantsi kotshintsho lwangoku kwimithetho yokuthumela ngaphandle, iinkampani zangaphandle ezisebenzisa izixhobo zase-US ukwenza iitshiphusi kuya kufuneka zifumane ilayisenisi yase-US ngaphambi kokuba zibonelele ngeentlobo ezithile zeetshiphusi kwiHuawei okanye i-HiSilicon encedisayo. Zombini iHuawei kunye ne-subsidiary yayo, kunye ne-TSMC, umboneleli ophambili weechips ze-HiSilicon, babephantsi kohlaselo.
Ngoku, ukuze iHuawei ifumane iichipsets ezithile okanye isebenzise uyilo lwechip olwenziwe kusetyenziswa isoftware kunye netekhnoloji kwiifemu zaseMelika, kuya kufuneka ifumane ilayisenisi kwiSebe lezoRhwebo laseMelika.
Njengoko isebe litshilo, uHuawei uya kuba nakho ukufumana iichipsets ezikwimveliso ngoku ngaphandle kwelayisenisi phakathi kweentsuku ezili-120 ukusuka kumhla wohlengahlengiso.
umthombo: 3dnews.ru