Intsebenziswano phakathi kwe-TSMC, i-Sony kunye ne-Denso, eyakhiwa kumazantsi-ntshona eJapan, kufuneka iqalise ukuvelisa iimveliso ze-serial kulo nyaka uzayo. Kwixesha elizayo, iya kukwazi ukuvelisa imveliso ye-28-nm kunye ne-12-nm, kodwa umcimbi awuyi kuphelela kwishishini elinye kule ndawo. Ingxelo yeendaba zaseJapan ukuba esinye isityalo se-TSMC siya kwakhiwa apha, esiya kukwazi ukuvelisa i-chips ze-6nm. Umthombo womfanekiso: Uphononongo lwe-Nikkei Asia, iToshiki Sasazu
umthombo: 3dnews.ru