Kwiminyaka yakutshanje, bonke abaphuhlisi beprosesa esembindini kunye negraphic bebekhangela izisombululo zendlela entsha. Inkampani ye-AMD ebizwa ngokuba yi "chiplets" apho iiprosesa ezine-architecture ze-Zen 2 zenziwe: iikristale ezininzi ze-7-nm kunye ne-crystal enye ye-14-nm kunye ne-I / O logic kunye nezilawuli zememori zifumaneka kwi-substrate enye. Intel ekudityanisweni kwi-substrate enye ithethe ixesha elide kwaye yade yasebenzisana ne-AMD ukwenza iiprosesa ze-Kaby Lake-G ukuze zibonise kwabanye abathengi ukusebenza kwalo mbono. Okokugqibela, kwaneNVIDIA, i-CEO yayo enebhongo ngokukwazi kweenjineli ukwenza iikristale ze-monolithic zobukhulu obumangalisayo, ikwinqanaba. kunye neengcamango zenzululwazi, ukuba nokwenzeka kokusebenzisa ilungiselelo le-multi-chip liyaqwalaselwa.
Nakwinxalenye elungiselelwe kwangaphambili yengxelo kwinkomfa yengxelo yekota, intloko ye-TSMC, CC Wei, igxininise ukuba inkampani iphuhlisa izisombululo zoyilo olunemigangatho emithathu ngentsebenziswano esondeleleneyo βneenkokeli ezininzi zeshishini,β kunye nokuveliswa ngobuninzi kwezo zinto. iimveliso ziyakusungulwa ngo-2021. Imfuno yeendlela ezintsha zokupakisha iboniswa kungekuphela ngabathengi kwicandelo lezisombululo eziphezulu, kodwa nabaphuhlisi bamacandelo ee-smartphones, kunye nabameli beshishini leemoto. Intloko ye-TSMC iqinisekile ukuba kwiminyaka edlulileyo, iinkonzo zokupakisha imveliso ye-XNUMXD ziya kuzisa ingeniso eninzi kwinkampani.
Uninzi lwabathengi be-TSMC, ngokutsho kukaXi Xi Wei, baya kuzibophelela ekudibaniseni izinto ezahlukeneyo kwixesha elizayo. Nangona kunjalo, ngaphambi kokuba uyilo olunjalo lusebenze, kuyafuneka ukuphuhlisa ujongano olusebenzayo lokutshintshiselana ngedatha phakathi kweetshiphu ezingafaniyo. Kufuneka ibe nokuphuma okuphezulu, ukusetyenziswa kwamandla aphantsi kunye nelahleko ephantsi. Kwixesha elizayo elingekude, ukwandiswa kweendlela zokuyila ezine-dimensional ezintathu kumthumeli we-TSMC kuya kwenzeka ngesantya esiphakathi, i-CEO yenkampani ishwankathele.
Abameli be-Intel kutshanje bathi kudliwano-ndlebe ukuba enye yeengxaki eziphambili kunye nokupakishwa kwe-3D kukutshatyalaliswa kobushushu. Iindlela ezintsha zokupholisa iiprosesa zexesha elizayo nazo ziyaqwalaselwa, kwaye amaqabane e-Intel akulungele ukunceda apha. Ngaphezu kweminyaka elishumi eyadlulayo, IBM sebenzisa inkqubo ye-microchannels yokupholisa ulwelo lweeprosesa eziphambili, ukususela ngoko inkampani yenze inkqubela phambili enkulu ekusebenziseni iinkqubo zokupholisa ulwelo kwicandelo lomncedisi. Imibhobho yobushushu kwiinkqubo zokupholisa ze-smartphone nayo yaqala ukusetyenziswa malunga neminyaka emithandathu eyadlulayo, ke nabona bathengi bagcinayo bakulungele ukuzama izinto ezintsha xa i-stagnation iqala ukubakhathaza.
Ukubuyela kwi-TSMC, kuya kuba kufanelekile ukongeza ukuba kwiveki ezayo inkampani iya kubamba umsitho eCalifornia apho iya kuthetha ngemeko ngophuhliso lwe-5-nm kunye ne-7-nm iinkqubo zobuchwepheshe, kunye neendlela eziphambili zokunyuka. iimveliso ze-semiconductor kwiipakethe. Uhlobo lwe-XNUMXD lukwakwi-ajenda yesiganeko.
umthombo: 3dnews.ru