TSMC kule veki ukubamba inqanaba elitsha letekhnoloji ye-lithographic, echongwe i-N6. Ushicilelo lweendaba lwathi eli nqanaba le-lithography liya kuziswa kwinqanaba lokuveliswa komngcipheko ngekota yokuqala ye-2020, kodwa kuphela inkcazo yenkomfa yekota ye-TSMC yokunika ingxelo eyenza ukuba kube lula ukufunda iinkcukacha ezintsha malunga nexesha lokuphuhliswa kwenkqubo. ebizwa ngokuba yi-6-nm iteknoloji.
Kufuneka kukhunjulwe ukuba i-TSMC isele ivelisa ubuninzi beemveliso ze-7-nm - kwikota yokugqibela benza i-22% yengeniso yenkampani. Ngokwezibikezelo zolawulo lwe-TSMC, kulo nyaka inkqubo ye-N7 kunye ne-N7 + ye-teknoloji iya kwenza ubuncinane i-25% yengeniso. Isizukulwana sesibini sobuchwephesha benkqubo ye-7nm (N7 +) siquka ukwanda kokusetyenziswa kwe-ultra-hard ultraviolet (EUV) lithography. Ngelo xesha, njengoko abameli be-TSMC begxininisa, yayingamava afunyenwe ngexesha lokuphunyezwa kwenkqubo yezobugcisa ye-N7 + eyavumela inkampani ukuba inike abathengi inkqubo ye-N6 yezobugcisa, elandela ngokupheleleyo i-ecosystem ye-N7 yoyilo. Oku kuvumela abaphuhlisi ukuba batshintshe ukusuka ku-N7 okanye ku-N7+ ukuya ku-N6 ngexesha elifutshane elinokwenzeka kunye neendleko zempahla ezincinci. I-CEO ye-CC Wei yada yabonisa ukuzithemba kwinkomfa yekota yokuba bonke abathengi be-TSMC abasebenzisa inkqubo ye-7nm baya kutshintshela kwi-teknoloji ye-6nm. Ngaphambili, kwimeko efanayo, ukhankanye ukulungelelaniswa "phantse bonke" abasebenzisi be-TSMC ye-7nm ye-teknoloji yenkqubo yokufudukela kwi-teknoloji yenkqubo ye-5nm.
Kuya kufaneleka ukucacisa ukuba zeziphi iingenelo zeteknoloji yenkqubo ye-5nm (N5) eyenziwe yi-TSMC ibonelela. Njengoko u-Xi Xi Wei wavuma, malunga nomjikelo wobomi bakhe, i-N5 iya kuba yinto "ehlala ixesha elide" kwimbali yenkampani. Ngexesha elifanayo, ukusuka kumbono womphuhlisi, kuya kuhluka kakhulu kwi-teknoloji ye-6-nm yenkqubo, ngoko ke ukuguqulwa kwemigangatho ye-5-nm yokuyila kuya kufuna umgudu omkhulu. Ngokomzekelo, ukuba iteknoloji yenkqubo ye-6nm inika ukunyuka kwe-7% kwi-transistor density xa kuthelekiswa ne-18nm, ngoko ke umahluko phakathi kwe-7nm kunye ne-5nm iya kuba yi-80%. Ngakolunye uhlangothi, ukunyuka kwesantya se-transistor akuyi kudlula i-15%, ngoko i-thesis malunga nokunciphisa isenzo "somthetho kaMoore" iqinisekisiwe kule meko.
Konke oku akuthinteli intloko ye-TSMC ekubeni ibango lokuba iteknoloji yenkqubo ye-N5 iya kuba "yeyona nto ikhuphisanayo kwishishini." Ngoncedo lwayo, inkampani ayilindelanga nje ukwandisa isabelo sayo semarike kumacandelo akhoyo, kodwa kunye nokutsala abathengi abatsha. Kwimeko yokulawula iteknoloji yenkqubo ye-5nm, amathemba akhethekileyo abekwe kwicandelo lezisombululo ze-high-performance computing (HPC). Ngoku ayithethi ngaphezulu kwe-29% yengeniso ye-TSMC, kwaye i-47% yengeniso ivela kumacandelo ee-smartphones. Ngokuhamba kwexesha, isabelo secandelo le-HPC kuya kufuneka sonyuke, nangona abaphuhlisi beeprosesa zee-smartphones baya kukulungela ukuyazi imigangatho emitsha ye-lithographic. Ukuphuhliswa kwenethiwekhi yesizukulwana se-5G kuya kuba esinye sezizathu zokukhula kwengeniso kwiminyaka ezayo, inkampani ikholelwa.
Ekugqibeleni, i-CEO ye-TSMC iqinisekisile ukuqala kwemveliso ye-serial isebenzisa iteknoloji yenkqubo ye-N7 + isebenzisa i-EUV lithography. Umgangatho wesivuno seemveliso ezifanelekileyo usebenzisa le nkqubo yobugcisa ithelekiswa neteknoloji yokuqala ye-7nm. Ukungeniswa kwe-EUV, ngokukaXi Xi Wei, ayinakubonelela ngembuyekezo yezoqoqosho kwangoko- ngelixa iindleko ziphezulu kakhulu, kodwa nje ukuba imveliso "izuze amandla", iindleko zemveliso ziya kuqala ukwehla ngesantya esiqhelekileyo kwiminyaka yakutshanje.
umthombo: 3dnews.ru