Umvelisi we-semiconductor waseTaiwan i-TSMC ubhengeze ukuqaliswa kokuveliswa kobuninzi beenkqubo ze-single-chip esebenzisa inkqubo ye-7-nm + yezobuchwepheshe. Kuyafaneleka ukuba uqaphele ukuba umthengisi uvelisa iitshiphusi okokuqala ngqa usebenzisa i-lithography kuluhlu olunzima lwe-ultraviolet (EUV), ngaloo ndlela ethatha elinye inyathelo lokukhuphisana ne-Intel kunye ne-Samsung.
I-TSMC iyaqhubeka nentsebenziswano kunye neHuawei yaseTshayina ngokusungula ukuveliswa kweenkqubo ezintsha ze-Kirin 985 ze-single-chip, eziza kuba sisiseko see-smartphones ze-Tech 30 zaseTshayina. Inkqubo efanayo yokuvelisa isetyenziselwa ukwenza iitshiphusi ze-Apple ze-A13, ekulindeleke ukuba zisetyenziswe kwi-iPhone ka-2019.
Ukongeza ekubhengezeni ukuveliswa kobuninzi beetshiphusi ezintsha, i-TSMC yathetha ngezicwangciso zayo zekamva. Ngokukodwa, kuye kwaziwa malunga nokuqaliswa kovavanyo lweemveliso ze-5-nanometer usebenzisa iteknoloji ye-EUV. Ukuba izicwangciso zomenzi aziphazamiseki, ukuveliswa kwe-serial ye-5-nanometer chips kuya kuqaliswa kwikota yokuqala yonyaka ozayo, kwaye baya kukwazi ukubonakala kwiimarike kufuphi ne-2020 phakathi.
Iplanti entsha yenkampani, ekuMazantsi eSayensi kunye neTekhnoloji Park eTaiwan, ifumana ufakelo olutsha malunga nenkqubo yemveliso. Ngelo xesha, esinye isityalo se-TSMC siqala umsebenzi wokulungiselela inkqubo ye-3-nanometer. Kukwakho nenkqubo yenguqu ye-6nm ekuphuhlisweni, ekusenokwenzeka ukuba ibe luphuculo olusuka kobuchwephesha be-7nm obusetyenziswayo ngoku.
umthombo: 3dnews.ru