Ngokutsho kwenyathelo elitsha, iMelika , iinkampani ezisebenzisana neHuawei zineentsuku ezilikhulu elinamashumi amabini zokufumana ilayisenisi ekhethekileyo ebavumela ukuba baqhubeke nale misebenzi kwicandelo lezobuchwepheshe. Emva koku, kulindeleke ukuba i-TSMC ayizukwazi ukubonelela iHuawei ngeeprosesa ezenzelwe i-HiSilicon encedisayo.
Ngokwendalo, ngelixa uHuawei ezama ukuqinisekisa abathengi ngeengxelo zobukho bogcino olubalulekileyo lwamacandelo ezikhululo ezisisiseko zothungelwano lonxibelelwano lwe-5G, kodwa ngenye imini ziya kupheliswa, kwaye uxinzelelo lwabasemagunyeni baseMelika, ngokucacileyo, alunakuze lube buthathaka. IHuawei ithathwa njengomthengi wesibini ngobukhulu kwi-TSMC emva kwe-Apple, kwaye isigebenga saseTshayina sinokuphendula ukuya kuthi ga kwi-15% yengeniso yekontraka yaseTaiwan. Kuba i-TSMC ixhomekeke kwizixhobo zemvelaphi yaseMelika kunye netekhnoloji, imigaqo emitsha yentsebenziswano neHuawei yenza ukuba kungenzeki.
Kwiinyanga zamva nje, imithombo yeendaba ibisoloko ijikela kwisihloko sentsebenziswano phakathi kweHuawei kunye neSMIC, esekwe eShanghai. Kwatyholwa ukuba ezinye zeeprosesa ze-HiSilicon zeselfowuni zisandula kuveliswa yi-SMIC isebenzisa eyona nkqubo iphambili ye-14-nm yetekhnoloji yekontraka yaseTshayina. Ngokwezinye iingxelo, le migangatho yetekhnoloji ibonelela ngepesenti enye yengeniso ye-SMIC; le nkampani ayisayi kukwazi ukwanelisa ngokupheleleyo iimfuno zeHuawei.
Uhlelo ichaza ukuba i-SMIC ikwasebenzisa izixhobo ezivela kubaboneleli baseMelika kunye nesoftware yaseMelika emsebenzini wayo. Ke, ukuvinjwa kwentsebenziswano kunye neHuawei kusebenza nakwi-SMIC, ke abokuqala abayi kukwazi ukufumana usindiso kumgca wendibano yesibini.
Ababoneleli bangaphandle bamacandelo eHuawei afana ne-Samsung, i-SK Hynix kunye ne-Kioxia (eyayisakuba yi-Toshiba Memory) abaxhomekeke kwizohlwayo zase-US kuphela ukuba abayincedi inkampani yase-China ukuphuhlisa kunye nokuvelisa iprosesa yayo. Ke, i-Samsung inokubonelela iHuawei ngeechips zememori, kodwa ayikwazi ukuvelisa iiprosesa zokuodola kulo mthengi. Okwangoku, izenzo zase-US zicima ukufikelela kukaHuawei kwiitekhnoloji zelithography eziphucukileyo.
umthombo: 3dnews.ru