I-Taiwan Semiconductor Manufacturing Company (TSMC) iya kuqalisa imveliso eninzi yee-Huawei HiSilicon Kirin 985 iiprosesa zeselula ngaphambi kokuphela kwekota yangoku, njengoko kuxelwe yi-DigiTimes.
Ulwazi malunga nokulungiswa kwe-chip ye-Kirin 985 yee-smartphones ezinamandla sele ikhona kwi-Intanethi. Le mveliso iya kuba yinguqulelo ephuculweyo yeprosesa ye-Kirin 980, edibanisa ii-cores ezisibhozo kunye nesantya sewotshi ukuya kwi-2,6 GHz kunye ne-ARM Mali-G76 ye-graphics accelerator.
Ukwenziwa kwe-chip ye-Kirin 985, imigangatho ye-nanometers ye-7 kunye ne-photolithography ekukhanyeni okunzulu kwe-ultraviolet (EUV, Ukukhanya okugqithisileyo kwe-Ultraviolet) kuya kusetyenziswa. Inkqubo yobugcisa ehambelanayo evela kwi-TSMC yonyulwe i-N7+.
Ii-smartphones zokuqala ezisekwe kwiqonga le-Kirin 985 ngokubonakalayo ziya kuthi zingabikho ngaphambi kwekota yesithathu.
Kwakhona kwaphawulwa ukuba i-TSMC kungekudala iza kwazisa itekhnoloji ephuculweyo ye-N7 +, eya kubizwa ngokuba yi-N7 Pro. Kucetywa ukuba kusetyenziswe ukwenziwa kweeprosesa ze-A13 eziyalelwe yiApple. Ezi chips ziya kuba sisiseko sezixhobo ze-iPhone zesizukulwana esitsha.
Ukongeza, i-DigiTimes resource yongeza ukuba i-TSMC inokuququzelela ukuveliswa kobuninzi beemveliso ze-5-nanometer ekupheleni kwalo nyaka okanye ekuqaleni konyaka ozayo.
umthombo: 3dnews.ru