Iprosesa ye-HiSilicon Kirin 9010 ngaphakathi kwee-smartphones zeHuawei Pura 70 iveliswa yi-SMIC isebenzisa itekhnoloji ye-7nm.
Ii-smartphones ze-Huawei Pura 70 zosapho ezinikezelwe kwiveki ephelileyo zixhotyiswe ngokufanelekileyo ngezona ziprosesa zangoku ze-HiSilicon zoyilo lwazo, kwaye kumagosa aseMelika umnqweno yayikukuba i-SMIC iwagcinile na amandla okuvelisa iitshiphusi ezisi-7-nm phantsi kwezohlwayo. Ngokweengcali zeqela lesithathu, iiprosesa ze-7nm ziphinda zibonwe ngaphakathi kwee-smartphones ezintsha zeHuawei. Umthombo womfanekiso: Huawei TechnologiesSource: 3dnews.ru