Umthuthukisi okuwukuphela kwakhe emhlabeni wama-chips enkumbulo we-MRAM anamandla kazibuthe, i-Everspin Technologies, uyaqhubeka nokuthuthukisa ubuchwepheshe bokukhiqiza. Namuhla i-Everspin ne-GlobalFoundries ndawonye ukuthuthukisa ubuchwepheshe bokukhiqiza ama-STT-MRAM microcircuits anamazinga angu-12 nm kanye nama-transistors e-FinFET.
I-Everspin inamalungelo obunikazi angaphezu kuka-650 nezinhlelo zokusebenza ezihlobene nenkumbulo ye-MRAM. Lena inkumbulo, ebhalela ingqamuzana efana nokubhala ukwaziswa ku-magnetic plate ye-hard disk. Kuphela esimweni sama-microcircuits lapho iseli ngalinye linekhanda layo (ngokwemibandela) elizibuthe. Inkumbulo ye-STT-MRAM ethathe indawo yayo, ngokusekelwe kumphumela wokudlulisa umfutho we-electron spin, isebenza ngisho nezindleko zamandla eziphansi, njengoba isebenzisa imisinga ephansi kumamodi okubhala nokufunda.
Ekuqaleni, inkumbulo ye-MRAM eyalwe ngabakwa-Everspin yakhiqizwa yi-NXP embonini yayo e-USA. Ngo-2014, u-Everspin wangena esivumelwaneni sokusebenzisana ne-GlobalFoundries. Ndawonye, baqala ukuthuthukisa izinqubo zokukhiqiza ezihlukene nezishumekiwe ze-MRAM (STT-MRAM) zisebenzisa izinqubo zokukhiqiza ezithuthuke kakhulu.
Ngokuhamba kwesikhathi, izikhungo ze-GlobalFoundries zethule ukukhiqizwa kwama-chips angu-40-nm kanye nama-28-nm STT-MRAM (okugcina ngomkhiqizo omusha - i-chip ye-1-Gbit discrete STT-MRAM), futhi zalungiselela nobuchwepheshe benqubo ye-22FDX yokuhlanganisa i-STT- I-MRAM ihlelwa ibe yizilawuli ezisebenzisa ubuchwepheshe benqubo ye-22-nm nm kumawafa e-FD-SOI. Isivumelwano esisha phakathi kwe-Everspin ne-GlobalFoundries sizoholela ekudlulisweni kokukhiqizwa kwama-STT-MRAM chips kubuchwepheshe benqubo ye-12-nm.
Inkumbulo ye-MRAM isondela ekusebenzeni kwenkumbulo ye-SRAM futhi ingase ingene esikhundleni sayo kuzilawuli ze-inthanethi Yezinto. Ngesikhathi esifanayo, ayiguquguquki futhi imelana kakhulu nokugqoka kunenkumbulo evamile ye-NAND. Ukushintshela kumazinga angu-12 nm kuzokhuphula ukuminyana kokurekhoda kwe-MRAM, futhi lokhu kuyisici sayo esiyinhloko.
Source: 3dnews.ru