Kanye nesimemezelo samaphrosesa wedeskithophu ye-Ryzen 3000 esekwe ku-Zen 2 microarchitecture, i-AMD yembule ngokusemthethweni imininingwane nge-X570, i-chipset entsha yamabhodi omama we-Socket AM4. Ukuqamba okusha okuyinhloko kule chipset ukusekelwa kwebhasi le-PCI Express 4.0, kodwa ngaphezu kwalokhu, ezinye izici ezithakazelisayo zitholwe.
Kuhle kugcizelelwe zisuka nje ukuthi ama-motherboards amasha asekelwe ku-X570, azovela emashalofini esitolo maduze nje, aklanyelwe ukusebenza nebhasi le-PCI Express 4.0 kusukela ekuqaleni. Lokhu kusho ukuthi zonke izikhala kumabhodi amasha zizokwazi ukusebenza ngamadivayisi ahambisanayo kumodi entsha yesivinini esikhulu ngaphandle kokubhukha (uma iprosesa yesizukulwane sesithathu se-Ryzen ifakiwe ohlelweni). Lokhu kusebenza kuzo zombili izikhala ezixhunywe kusilawuli sephrosesa sebhasi ye-PCI Express kanye nalezo zikhala lapho isilawuli se-chipset sinesibopho sazo.
Isethi enengqondo ye-X570 ngokwayo iyakwazi ukusekela imizila efika kweyi-16 ye-PCI Express 4.0, kodwa ingxenye yale migqa ingahlelwa kabusha ibe yizimbobo ze-SATA. Ngaphezu kwalokho, i-chipset inesilawuli esizimele se-SATA esinamachweba amane, isilawuli se-USB 3.1 Gen2 esisekelwa amachweba ayisishiyagalombili ayi-10-Gigabit, kanye nesilawuli se-USB 2.0 esisekelwa izimbobo ezi-4.
Kodwa-ke, udinga ukuqonda ukuthi ukusebenza kwenani elikhulu lama-peripherals ngesivinini esikhulu kumasistimu asekelwe ku-X570 kuzonqunyelwa umkhawulokudonsa webhasi elixhuma iphrosesa ku-chipset. Futhi leli bhasi lisebenzisa imizila emine kuphela ye-PCI Express 4.0 uma iphrosesa ye-Ryzen 3000 ifakwe ebhodini, noma imizila emine ye-PCI Express 3.0 lapho ifaka amaphrosesa ezizukulwaneni ezedlule.
Kuyafaneleka ukukhumbula ukuthi i-Ryzen 3000 system-on-chip nayo inamakhono ayo: ukusekelwa kwemizila engu-20 ye-PCI Express 4.0 (imigqa engu-16 yekhadi lemifanekiso nemigqa emi-4 yedrayivu ye-NVMe), kanye namachweba angu-4 we-USB 3.1 Gen2. Konke lokhu kuvumela abakhiqizi be-motherboard ukuthi bakhe amapulatifomu avumelana nezimo kakhulu futhi asebenzayo asekelwe ku-X570 enenombolo enkulu ye-PCIe enesivinini esikhulu, izikhala ze-M.2, izilawuli ezihlukahlukene zenethiwekhi, izimbobo zesivinini esikhulu se-peripherals, njll.
Ukushisa kokushisa kwe-chipset ye-X570 empeleni kungu-15 W uma kuqhathaniswa no-6 W kuma-chipsets esizukulwane sangaphambilini, kodwa i-AMD ikhuluma ngenguqulo "eyenziwe lula" ye-X570, lapho ukukhishwa kokushisa kuzoncishiswa ku-11 W ngokususa inombolo ethile ye-PCI. Imigqa ye-Express 4.0. Kodwa-ke, i-X570 isalokhu iyi-chip eshisa kakhulu, okubangelwa ngokuyinhloko ukuhlanganiswa kwesilawuli sebhasi se-PCI Express esinesivinini esiphezulu ku-chip.
I-AMD iqinisekise ukuthi i-chipset ye-X570 yathuthukiswa yiyo ngokuzimela, kuyilapho ukuklanywa kwama-chipsets adlule kwenziwa usonkontileka wangaphandle - i-ASMedia.
Abakhiqizi be-motherboard abahamba phambili bazokwethula imikhiqizo yabo esekwe ku-X570 ezinsukwini ezizayo. I-AMD ithembisa ukuthi ububanzi bayo buzoba namamodeli okungenani angama-56 esewonke.
Source: 3dnews.ru