Abahlaziyi balindele ukuwa kwemakethe ye-semiconductor ngo-2019

Izinqubo ezenzeka emakethe ziphoqa abahlaziyi ukuthi babuyekeze izibikezelo zabo zesimo semboni ye-semiconductor. Futhi ukulungiswa abakwenzayo kuyakhuthaza, uma kungekona okwesabisayo, khona-ke okungenani ukukhathazeka: amanani okuthengiswa okulindelekile emikhiqizo ye-silicon yalo nyaka ngokuhlobene nezibikezelo zokuqala ancishiswa ngenani lamadijithi amabili lamaphoyinti. Isibonelo, ngokombiko wakamuva ovela kwa-IHS Markit, imakethe yemikhiqizo ye-semiconductor izoncipha ngo-7,4% uma kuqhathaniswa nonyaka odlule. Ngokuphelele, lokhu kusho ukwehla kwezinga lokuthengisa ngamadola ayizigidi eziyizinkulungwane ezingama-35,8 kuya ku-$446,2. Kodwa ukulungiswa okunjalo kuyesabisa ikakhulukazi uma kubhekwa ukuthi inguqulo yangaphambilini yokuhlolwa kwesimo semakethe, eshicilelwe ngoDisemba 2018, ithathe ukunyuka kwe-2,9% . Ngamanye amazwi, isithombe siwohloka ngokushesha.

Abahlaziyi balindele ukuwa kwemakethe ye-semiconductor ngo-2019

Elinye iqiniso elingajabulisi embonini ukuthi ukwehla kwemakethe ngo-2019% okwabikezelwa abahlaziyi be-IHS Markit ngonyaka wezi-7,4 kuzoba ukwehla okujulile kwemboni ye-semiconductor selokhu kwaba nenkinga yezomnotho emhlabeni wonke ngo-2009, lapho ukuthengiswa sekukonke kwama-silicon chips kwehle ngo-11%.

Isibikezelo esibuyekeziwe se-IHS Markit sihambisana nezibalo zezinye izinkampani ezihlaziyayo, eziphinde zaqaphela ukwehla okuqinile okuvela kwikota yokuqala. Ngakho, i-IC Insight ibikezela ukwehla okungu-9% ekuthengisweni kwama-chip kulo nyaka wamanje uma kuqhathaniswa nonyaka odlule. Futhi iqembu lezibalo ku-Association of Semiconductor Manufacturers, lisebenzisa idatha evela kubakhiqizi abangamalungu, lilindele ukuthi imakethe yehle ngo-3%.

Abahlaziyi balindele ukuwa kwemakethe ye-semiconductor ngo-2019

Kuyathakazelisa ukuthi ngokusho kukaMyson Robles Bruce, umphathi wocwaningo kwa-IHS, abahlinzeki abaningi bemikhiqizo ye-semiconductor ekuqaleni babenethemba elikhulu futhi bekulindeleke ukuthi babone ukukhula kokuthengisa, noma kuncane, ngo-2019. Kodwa-ke, ukuzethemba kwabakhi bama-chip "kushintshe ngokushesha kwaba ukwesaba njengoba bebona ukujula nokuqina kokwehla kwamanje." Ubucayi bezinkinga ezizayo emakethe yemikhiqizo ye-semiconductor buhlotshaniswa nesidingo esibuthakathaka kanye nokugcwala okunamandla kwezindawo zokugcina impahla engxenyeni yokuqala. Ukwehla okuphawuleka kakhulu kwemali engenayo kufinyelele ku-DRAM, NAND, ama-microcontrollers enhloso ejwayelekile, ama-microcontrollers angama-32-bit kanye namasegimenti e-ASIC. Lapha, ukuthengiswa kwehle ngamaphesenti anezinombolo ezimbili.

Kodwa-ke, kwisibikezelo sakamuva se-IHS bekukhona nendawo β€œye-ray yethemba”. Naphezu kokwehla okukhulu kakhulu kule minyaka eyishumi edlule, imakethe ye-semiconductor izoqala ukusimama engxenyeni yesithathu yalo nyaka. Amandla amakhulu okushayela kule nqubo kuzoba ukuthengiswa kwama-flash memory chips, okulindeleke ukuthi akhule kusukela engxenyeni yesibili yonyaka phakathi nesidingo esikhulayo samadrayivu e-solid-state, ama-smartphone, ama-laptops namaseva. Ngaphezu kwalokho, abahlaziyi babikezela ukwanda okungenzeka kwesidingo samaphrosesa weseva engxenyeni yesibili yonyaka.



Source: 3dnews.ru

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