Inguqulo yesibili yobuchwepheshe be-Xtacking ilungiselelwe i-Chinese 3D NAND

Indlela bika Izikhungo zezindaba zaseShayina, i-Yangtze Memory Technologies (YMTC) ilungise inguqulo yesibili yobuchwepheshe bayo be-Xtacking ukuze bathuthukise ukukhiqizwa kwememori ye-flash ye-3D NAND enezingqimba eziningi. Ubuchwepheshe be-Xtacking, siyakhumbula, lwethulwa esithangamini saminyaka yonke se-Flash Memory Summit ngo-Agasti wonyaka odlule futhi saze sathola umklomelo esigabeni esithi “Isiqalo esithuthuke kakhulu emkhakheni wenkumbulo ye-flash.”

Yebo, ukubiza ibhizinisi elinesabelomali sezigidigidi zamadola njengesiqalo kubukela phansi inkampani, kodwa, masikhulume iqiniso, i-YMTC ayikakhiqizi imikhiqizo ngobuningi. Le nkampani izothuthela ezintweni eziningi zezentengiselwano ze-3D NAND ngasekupheleni kwalo nyaka lapho yethula ukukhiqizwa kwememori engu-128-Gbit 64-layer, leyo, ngendlela, ezosekelwa yibo lobo buchwepheshe obusha be-Xtacking.

Ngokulandelayo emibikweni yakamuva, muva nje kuforamu ye-GSA Memory+, u-Yangtze Memory CTO Tang Jiang uvumile ukuthi ubuchwepheshe be-Xtacking 2.0 buzokwethulwa ngo-Agasti. Ngeshwa, inhloko yezobuchwepheshe yenkampani ayizange ihlanganyele imininingwane yentuthuko entsha, ngakho-ke kufanele silinde kuze kube ngu-Agasti. Njengoba umkhuba odlule ubonisa, inkampani igcina imfihlo kuze kube sekupheleni nangaphambi kokuqala kweFlash Memory Summit 2019, mancane amathuba okuthi sifunde okuthile okuthakazelisayo mayelana ne-Xtacking 2.0.

Ngokuqondene nobuchwepheshe be-Xtacking uqobo, inhloso yayo bekungamaphuzu amathathu: nikela umthelela omkhulu ekukhiqizweni kwe-3D NAND nemikhiqizo esuselwe kuyo. Lawa ijubane lokusebenzisana kwama-flash memory chips, ukwanda kokurekhoda kwabantu kanye nesivinini sokuletha imikhiqizo emisha emakethe. Ubuchwepheshe be-Xtacking bukuvumela ukuthi ukhuphule izinga lokushintshisana ngohlelo lwenkumbulo kuma-chips e-3D NAND ukusuka ku-1–1,4 Gbit/s (ONFi 4.1 ne-ToggleDDR interface) ukuya ku-3 Gbit/s. Njengoba umthamo wama-chips ukhula, izidingo zejubane lokushintshisana zizokhula, futhi amaShayina anethemba lokuba ngowokuqala ukwenza impumelelo kule ndawo.

Kunesinye isithiyo ekwandiseni ukuminyana kokurekhoda - ukuba khona ku-chip ye-3D NAND engeyona nje inkumbulo yohlu, kodwa nokulawula okuzungezile kanye namasekhethi amandla. Lawa masekhethi asusa ku-20% kuya ku-30% wendawo esebenzisekayo ohlwini lwenkumbulo, futhi u-128% we-chip surface uzosuswa kuma-chips angu-50-Gbit. Endabeni yobuchwepheshe be-Xtacking, i-memory array ikhiqizwa ku-chip yayo, futhi ama-circuits okulawula akhiqizwa kwenye. Ikristalu izinikele ngokuphelele kumaseli enkumbulo, futhi amasekethe okulawula esigabeni sokugcina somhlangano we-chip anamathiselwe kukristalu ngenkumbulo.

Ukukhiqiza okuhlukene nokuhlanganisa okulandelayo kuvumela ukuthuthukiswa okusheshayo kwama-chips enkumbulo yangokwezifiso kanye nemikhiqizo yangokwezifiso ehlanganiswa njengezitini ibe yinhlanganisela efanele. Le ndlela isivumela ukuthi sehlise ukuthuthukiswa kwama-memory chips okungenani ngezinyanga ezi-3 esikhathini esiphelele sokuthuthukiswa esiyizinyanga eziyi-12 kuye kweziyi-18. Ukuguquguquka okukhulu kusho intshisekelo ephezulu yamakhasimende, edingwa umkhiqizi osemusha waseShayina njengomoya.

Source: 3dnews.ru