UJulayi uphelile - inyanga yokuqala yekota yesithathu ka-2019 - futhi abahlaziyi besigaba se-DRAMeXchange yesikhulumi sokuhweba se-TrendForce ukubonwa nezibikezelo mayelana nokunyakaza kwentengo yememori ye-NAND esikhathini esizayo esiseduze. Kulokhu kube nzima ukwenza isibikezelo. Kwenzeke ngoJuni ukukhiqizwa embonini ye-Toshiba (ngokuhambisana ne-Western Digital), futhi inkampani isanda kubuyisela ukukhiqizwa kwe-flash ye-NAND ngokugcwele. Ngaphezu kwalokho, eJapane izinto zokusetshenziswa zokukhiqiza ama-chips eSouth Korea. I-US futhi inyusa ingcindezi yohwebo e-China, futhi ukukhiqizwa ngokweqile kwenkumbulo kanye nesidingo esibuthakathaka semakethe siphoqa abakhiqizi ukuthi banciphise ukutshalwa kwezimali ezimbonini namaphrojekthi. Kuzokwenzekani ngezintengo zenkumbulo ye-NAND?
Abahlaziyi be-DRAMeXchange banethemba lokuthi ngokuvamile, izintengo zenkontileka ye-NAND flash zizoqhubeka nokwehla ngekota yesithathu naphezu kwazo zonke izinkinga ezibalwe ngenhla. Uhlu oluphezulu lwama-chips e-NAND nemikhiqizo esekelwe kuyo, kanye nesidingo esiphansi semakethe, esingeke sithuthuke kakhulu ngisho nangenkathi evamile yokusebenza ngemva kwamaholide ehlobo, kuzoholela ekwehleni okwengeziwe kwezintengo zenkontileka ye-NAND. Izivumelwano zokunikezwa kwenkumbulo yenkontileka zaphothulwa ngoJuni ngaphambi kokuvalwa okuphuthumayo kwesitshalo saseToshiba, ngakho-ke lapho kuphothulwa izinkontileka ezintsha ngoSepthemba, lesi sici sizolahlekelwa noma senze buthaka ukubaluleka kwayo.
Enye into ethokozisayo: ngokumelene nokwasemuva kokwehla kwezintengo zenkontileka yamadrayivu neminye imikhiqizo esebenzisa ama-NAND chips, intengo yama-wafer e-silicon angakanqunywa abe amakristalu iyenyuka. Ukwehla kwenani elimaphakathi lokuthengisa lama-wafer e-NAND kuqhubekile kusukela ngoNovemba 2017 futhi sekufinyelele izinga lezindleko zokukhiqiza. Ukuvalwa okuphuthumayo kwemboni ye-Toshiba kuholele ekwehliseni ukunikezwa kwama-wafers acutshunguliwe, okunikeze ithuba abakhiqizi be-NAND chip ukuthi bakhuphule intengo yama-wafer anama-chips aphelile. Ekupheleni kukaJulayi, inani le-ASP le-silicon ye-NAND lenyuke ngo-15%. Ngo-Agasti, intengo yama-wafers nayo izoqhubeka nokukhuphuka, kodwa ngezinga elibuthakathaka, njengoba ukukhiqizwa kubuyele ezingeni langaphambilini. Kubalulekile kithi ukuthi lokhu kukhuphuka kwentengo ngeke kube nomthelela obonakalayo ezindlekweni zemikhiqizo enememori ye-flash ebhodini.
Ngokuqondene nokwethuka okubangelwa ubudlelwano oba buba bubi phakathi kweJapan neNingizimu Korea, ngeke babe nomthelela omkhulu ekukhiqizweni kwama-semiconductors yi-Samsung, SK Hynix noma abanye. Sikhuluma nje ngokungabandakanyi izinkampani zaseNingizimu Korea kulokho okubizwa “ngohlu olumhlophe” lwezinkampani ezihweba neJapan ezinemibhalo emincane yezimvume. Kuyaphawuleka ukuthi izinkampani zaseNingizimu Korea yizona kuphela zase-Asia ezisohlwini lwabamhlophe. Ukuqinisa imithetho yokusebenza, okuhlanganisa ukuthengwa kwezinto zokusetshenziswa e-Japan, kuzobeka kuphela izinkampani nezinkampani zaseNingizimu Korea ezivela kwamanye amazwe esifundeni emgqeni. Ngaphezu kwalokho, iziphathimandla zaseJapane sezivele zandisa inani lezisebenzi eminyangweni ephethe izimvume, futhi lokhu ngeke kudalele noma ubani izinkinga. Mhlawumbe kuzoshaya ukuzethemba kwamaKorea, kodwa lokhu ngeke kuthinte intengo ye-NAND. Akufanele kuboniswe.
Izintengo zenkontileka yamadrayivu e-EMMC/UFS (ama-smartphone) kanye nama-SSD amakhasimende azoqhubeka ehla ngo-August no-September, okuholela ekwehleni okungafika ku-5% kwekota iyonke. Ukwehla kwentengo kungase kunciphe ngekota yesine njengoba uhlu lwempahla lwehlela kumazinga avamile. Isigaba sokukhiqiza ngokweqile sizonqotshwa. Izintengo zenkontileka yama-SSD kwikota yesithathu zizokwehla kakhulu, ziye cishe ku-10%. Kukhona ukugcwala ngokweqile kule makethe. Imakethe ye-SSD yeseva inzima kakhulu - isathule, ngakho-ke izintengo zenkontileka yamadrayivu ezinkampani zizokwehla ziye ku-15% kwikota yesithathu. Sekukonke, ungakhululeka okwamanje. Izindleko zama-SSD zizoqhubeka zehla inyanga, ezimbili, futhi mhlawumbe isikhathi eside.
Source: 3dnews.ru