Ngokusho kwemithombo ye-Digitimes, ecaphuna imithombo yezimboni eTaiwan, uHuawei wabona kusengaphambili unswinyo lwamanje lwase-US futhi waqala ukuqoqa izingxenye ze-electronics ekupheleni konyaka odlule. Ngokwezilinganiso zokuqala, zizohlala kuze kube sekupheleni kuka-2019.
Masikhumbule ukuthi ngemuva kwesimemezelo sokuthi iziphathimandla zaseMelika zivimbe iHuawei, izinkampani ezimbalwa ezinkulu ze-IT zenqaba ngokushesha ukubambisana nayo. Phakathi kwalabo abanqume ukuyeka ukuhlinzeka ngobuchwepheshe babo kumkhiqizo waseShayina kukhona iGoogle, Intel, Qualcomm, Xilinx kanye neBroadcom.
Ukuqinisekisa ukuhlinzekwa okungaphazamiseki kwezingxenye ze-semiconductor, i-Huawei ifune ukuthi ozakwethu baseTaiwan baqale ukuzihlinzeka ngokusekelwe kuma-oda abekwe ngaphambilini kwikota yokuqala ka-2019. Ngokusho kochwepheshe, lokhu kuzothambisa imiphumela yemikhawulo ebekwe yi-United States okungenani kuze kuphele unyaka.
Ngasikhathi sinye, njengoba i-Digitimes iphawula, hhayi iHuawei kuphela, kodwa futhi nabahlinzeki bayo bazohlushwa unswinyo lwaseMelika. Isibonelo, i-TSMC yaseTaiwan ikhiqiza cishe wonke amaphrosesa eselula e-HiSilicon Kirin, asetshenziswa njengengxenyekazi yehadiwe kuma-smartphones e-Huawei kanye ne-Honor. NgoMsombuluko odlule umenzi we-chip , okuthi, naphezu kwesimo samanje, ngeke iyeke ukuhlinzeka uHuawei ngama-chips eselula. Kodwa-ke, uma, ngaphansi kwengcindezi yezimo, umkhiqizi waseShayina ephoqeleka ukuthi anciphise umthamo wama-oda okukhiqizwa kwawo, lokhu kuzothinta kabi ukusebenza kwezimali kwe-TSMC.
Source: 3dnews.ru