Uma kubhekwa umgoqo osondelayo ekukhiqizeni ama-chip, okungenakwenzeka ukwehliswa okuqhubekayo kwezinqubo zobuchwepheshe, ukupakishwa kwamakristalu ngama-chip amaningi kuyeza phambili. Ukusebenza kwamaphrosesa esikhathi esizayo kuzokalwa ngobunkimbinkimbi, noma okungcono kakhulu, ubunkimbinkimbi bezixazululo. Uma imisebenzi eminingi inikezwa i-chip encane yokucubungula, yilapho yonke inkundla izoba namandla futhi isebenze kahle kakhulu. Kulesi simo, iphrosesa ngokwayo izoba isiteji senqwaba yamakristalu ahlukahlukene axhunywe ibhasi elihamba ngesivinini esikhulu, okungeke kube kubi kakhulu (ngokwejubane nokusetshenziswa) kunokuba kube yikristalu eyodwa ye-monolithic. Ngamanye amazwi, iphrosesa izoba kokubili ibhodi lomama kanye nesethi yamakhadi okunweba, okuhlanganisa inkumbulo, ama-peripherals, njalonjalo.
I-Intel isivele ikhombisile ukuqaliswa kobuchwepheshe obubili bobunikazi bokupakishwa kwendawo yamakristalu angafani ephaketheni elilodwa. Lezi yi-EMIB kanye . Esokuqala izixhumi ezibonakalayo zebhuloho ezakhelwe endaweni engaphansi βekhuphukayoβ yokuhlelwa okuvundlile kwamakristalu, kanti eyesibili iwuhlelo lwezinhlayiya ezintathu noma ezistakiwe zamakristalu kusetshenziswa, phakathi kwezinye izinto, ngamashaneli e-metallization aqondile ama-TSV. Isebenzisa ubuchwepheshe be-EMIB, inkampani ikhiqiza ama-FPGA esizukulwane se-Stratix X kanye ne-Kaby Lake G hybrid processors, kanti ubuchwepheshe be-Foveros buzosetshenziswa emikhiqizweni yokuhweba engxenyeni yesibili yalo nyaka. Isibonelo, izosetshenziselwa ukukhiqiza ama-laptops aseLakefield.
Vele, i-Intel ngeke igcine lapho futhi izoqhubeka nokuthuthukisa ngenkuthalo ubuchwepheshe bokupakishwa kwe-chip okuqhubekayo. Izimbangi zenza into efanayo. Kanjani , futhi abakwaSamsung bathuthukisa ubuchwepheshe bokuhlelwa kwendawo kwamakristalu (chiplets) futhi bahlose ukuqhubeka nokudonsa ingubo yamathuba amasha kubo.
Muva nje, engqungqutheleni ye-SEMICON West, i-Intel futhi ukuthi ubuchwepheshe bayo bokufaka ama-chip amaningi buthuthuka ngesivinini esihle. Umcimbi wethule ubuchwepheshe obuthathu, ukuqaliswa kwazo okuzokwenzeka maduze nje. Kumele kushiwo ukuthi bonke ubuchwepheshe obuthathu ngeke bube yizindinganiso zemboni. I-Intel izigcinela yonke intuthuko futhi izohlinzeka kuphela kumakhasimende ukuze kwenziwe izinkontileka.
Owokuqala kobuthathu obusha bobuchwepheshe bokupakishwa kwendawo yama-chiplets yi-Co-EMIB. Lena inhlanganisela yobuchwepheshe bokusebenzelana kwebhuloho le-EMIB obungabizi kakhulu nama-chiplets e-Foveros. Imiklamo ye-Foveros multi-chip stack ingaxhunywa nezixhumanisi ezivundlile ze-EMIB zibe izinhlelo eziyinkimbinkimbi ngaphandle kokudela ukusebenza noma ukusebenza. I-Intel ithi ukubambezeleka kanye nokuphuma kwazo zonke izixhumi ezibonakalayo ezinezingqimba eziningi ngeke kube kubi kakhulu kune-monolithic chip. Eqinisweni, ngenxa yokuminyana okwedlulele kwamakristalu ahlukahlukene, ukusebenza kahle kanye nokusebenza kahle kwamandla kwesixazululo kanye nezindawo zokusebenzelana kuzoba ngaphezulu kakhulu kunesimo sesixazululo se-monolithic.
Ngokokuqala ngqa, ubuchwepheshe be-Co-EMIB bungasetshenziselwa ukukhiqiza ama-Intel hybrid processors e-Aurora supercomputer, okulindeleke ukuthi ithunyelwe ngasekupheleni kuka-2021 (iphrojekthi ehlanganyelwe phakathi kwe-Intel ne-Cray). Iphrosesa ye-prototype processor yaboniswa e-SEMICON West njengenqwaba yabantu abafayo abancane abangu-18 endaweni eyodwa enkulu (i-Foveros), ipheya yakhona exhunywe ngokuvundlile ngoxhumano lwe-EMIB.
Okwesibili kobuchwepheshe obusha bokupakisha be-Intel bendawo bubizwa nge-Omni-Directional Interconnect (ODI). Lobu buchwepheshe bumane nje busebenzisa i-EMIB ne-Foveros ukuxhumana kukagesi okuvundlile nokume mpo kwamakristalu. Okwenze i-ODI yaba into ehlukile yiqiniso lokuthi inkampani isebenzise ukunikezwa kwamandla kagesi kuma-chiplets esitaki isebenzisa ukuxhumeka okuqondile kwama-TSV. Le ndlela izokwenza kube nokwenzeka ukusabalalisa ukudla ngempumelelo. Ngasikhathi sinye, ukumelana kweziteshi ze-TSVs ezingama-70-ΞΌm zokunikezwa kwamandla kuncishiswe kakhulu, okuzonciphisa inani lamashaneli adingekayo ukuze kuhlinzekwe amandla futhi kukhulule indawo ku-chip yama-transistors (isibonelo).
Ekugcineni, i-Intel ibize isikhombimsebenzisi se-chip-to-chip i-MDIO ubuchwepheshe besithathu bokupakisha kwendawo. Leli ibhasi le-Advanced Interface Bus (AIB) ngendlela yesendlalelo esibonakalayo sokushintshisana kwesignali ye-chip. Uma sikhuluma nje, lesi isizukulwane sesibili sebhasi le-AIB, i-Intel elithuthukela i-DARPA. Isizukulwane sokuqala se-AIB sethulwa ngo-2017 sinekhono lokudlulisa idatha kothintana naye ngamunye ngesivinini esingu-2 Gbit/s. Ibhasi le-MDIO lizohlinzeka ngokushintshisana ngesivinini esingu-5,4 Gbit/s. Lesi sixhumanisi sizoba yimbangi yebhasi le-TSMC LIPINCON. Isivinini sokudlulisa se-LIPINCON siphezulu - 8 Gbit/s, kodwa i-Intel MDIO inobukhulu obuphezulu be-GB/s ngemilimitha ngayinye: 200 uma iqhathaniswa no-67, ngakho i-Intel ifuna intuthuko engeyimbi kakhulu kuneyeqhudelana nayo.
Source: 3dnews.ru