Lapho amaphrosesa edeskithophu eqala ukwephula i-1 GHz, okwesikhashana kwabonakala sengathi akukho ndawo abangaya kuyo. Ekuqaleni, kwakungenzeka ukwandisa imvamisa ngenxa yezinqubo ezintsha zobuchwepheshe, kodwa ukuqhubeka kwamafrikhwensi ekugcineni kwehle ngenxa yezidingo ezikhulayo zokususwa kokushisa. Ngisho nama-radiator amakhulu nabalandeli ngezinye izikhathi abanaso isikhathi sokususa ukushisa kuma-chips anamandla kakhulu.
Abacwaningi baseSwitzerland banquma ukuzama ngokudlula uketshezi ngekristalu ngokwayo. Badizayine i-chip nesistimu yokupholisa njengeyunithi eyodwa, enamashaneli e-on-chip fluid abekwe eduze nezingxenye ezishisa kakhulu ze-chip. Umphumela uwukukhuphuka okumangalisayo kokusebenza ngokukhipha ukushisa okusebenzayo.
Ingxenye yenkinga ngokukhipha ukushisa ku-chip ukuthi ngokuvamile kuvame ukubandakanya izigaba eziningana: ukushisa kudluliselwa kusuka ku-chip kuya ku-chip packaging, bese kusuka emaphaketheni kuya ku-heatsink, bese kuya emoyeni (i-thermal paste, amagumbi omoya, njll. .ingase futhi ibandakanyeke ohlelweni Ngaphezu kwalokho). Sekukonke, lokhu kunciphisa inani lokushisa elingasuswa ku-chip. Lokhu kuyiqiniso nasezinhlelweni zokupholisa uketshezi ezisetshenziswayo njengamanje. Kungase kwenzeke ukubeka i-chip ngokuqondile oketshezini olusebenzisa ukushisa okushisayo, kodwa lokhu kwakamuva akufanele kuqhube ugesi noma kungene ekuphenduleni kwamakhemikhali ngezingxenye ze-elekthronikhi.
Sekuvele kube nemibukiso eminingana yokupholisa uketshezi lwe-on-chip. Ngokuvamile sikhuluma ngohlelo lapho idivayisi enesethi yamashaneli e-liquid ihlanganiswa nekristalu, futhi uketshezi ngokwalo luphonswa kulo. Lokhu kuvumela ukushisa kukhishwe ngokuphumelelayo ku-chip, kodwa ukuqaliswa kokuqala kubonise ukuthi kukhona ukucindezela okukhulu eziteshini futhi ukupompa amanzi ngale ndlela kudinga amandla amaningi - okungaphezu kokukhishwa kuprosesa. Lokhu kunciphisa ukusebenza kahle kwamandla kwesistimu futhi ngaphezu kwalokho kudala ukucindezeleka komshini okuyingozi ku-chip.
Ucwaningo olusha lwakha imibono yokuthuthukisa ukusebenza kahle kwezinhlelo zokupholisa ku-chip. Ukuze uthole isixazululo, izinhlelo zokupholisa ezinezinhlangothi ezintathu zingasetshenziswa - iziteshi ezincane ezineqoqo elakhelwe ngaphakathi (ama-microchannel amaningi ashumekiwe, i-EMMC). Kuzo, i-multi-dimensional hierarchical manifold iyingxenye yesiteshi esinamachweba amaningana okusabalalisa isipholile.
Abacwaningi bathuthukise i-monolithically manifold manifold microchannel (mMMC) ngokuhlanganisa i-EMMC ngqo ku-chip. Iziteshi ezifihliwe zakhiwe khona kanye ngaphansi kwezindawo ezisebenzayo ze-chip, futhi isipholile sigeleza ngokuqondile ngaphansi kwemithombo yokushisa. Ukwakha i-mMMC, okokuqala, izikhala eziwumngcingo zamashaneli ziqoshwa ku-silicon substrate embozwe nge-semiconductorβgallium nitride (GaN); khona-ke ukufakwa ngegesi ye-isotropic kusetshenziselwa ukwandisa izikhala ku-silicon kububanzi besiteshi esidingekayo; Ngemva kwalokhu, izimbobo ezisesigabeni se-GaN phezu kwamashaneli zivalwe ngethusi. I-chip ingenziwa isendlalelo se-GaN. Le nqubo ayidingi isistimu yokuxhuma phakathi komqoqi kanye nedivayisi.
Abacwaningi basebenzise imojula ye-electronic yamandla eguqula i-alternating current ukuze iqondise okwamanje. Ngosizo lwayo, ukugeleza kokushisa okungaphezu kuka-1,7 kW/cm2 kungapholiswa kusetshenziswa amandla okupompa angu-0,57 W/cm2 kuphela. Ngaphezu kwalokho, uhlelo lubonisa ukusebenza kahle kakhulu kokuguqulwa kunomshini ofanayo ongapholi ngenxa yokuntuleka kokuzifudumeza.
Kodwa-ke, akufanele ulindele ukubonakala okuseduze kwama-chips asekelwe ku-GaN anesistimu yokupholisa edidiyelwe - inani lezinkinga eziyisisekelo zisadinga ukuxazululwa, njengokuzinza kwesistimu, imikhawulo yezinga lokushisa, nokunye. Nokho, lesi isinyathelo esibalulekile esiya ekusaseni eliqhakazile nelibandayo.
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Source: 3dnews.ru