I-Intel ikhuluma kakhulu ngesakhiwo sendawo sama-Foveros processors, isihlolile ku-Lakefield ephathwayo, futhi ekupheleni kuka-2021 isiyisebenzisela ukwakha ama-processor ehluzo angama-7nm. Emhlanganweni phakathi kwabamele i-AMD nabahlaziyi, kwacaca ukuthi imibono enjalo ayiyona into engavamile kule nkampani.
Emcimbini wakamuva we-FAD 2020, i-AMD CTO Mark Papermaster ikwazile ukukhuluma kafushane ngendlela yesikhathi esizayo yokuthuthukiswa kokuvela kwezixazululo zokupakisha. Emuva ngo-2015, ama-Vega graphics processors asebenzisa lokho okubizwa nge-layout engu-2,5-dimensional, lapho ama-memory chips ohlobo lwe-HBM abekwa endaweni engaphansi efanayo nekristalu ye-GPU. I-AMD yasebenzisa i-planar multi-chip design ngo-2017; eminyakeni emibili kamuva, wonke umuntu wajwayela ukuthi akukho typo egameni elithi "chiplet".
Ngokuzayo, njengoba isilayidi sesethulo sichaza, i-AMD izoshintshela esakhiweni esiyingxube esizohlanganisa izici ze-2,5D ne-3D. Umfanekiso unikeza umbono omubi wezici zalolu hlelo, kodwa phakathi nendawo ungabona amakristalu amane endizeni efanayo, ezungezwe izitaki ezine zenkumbulo ye-HBM yesizukulwane esihambisanayo. Ngokusobala, ukuklanywa kwe-substrate evamile kuzoba nzima kakhulu. I-AMD ilindele ukuthi ukushintshela kulesi sakhiwo kuzokwandisa ukuminyana kokuxhumana kwephrofayela izikhathi eziyishumi. Kunengqondo ukucabanga ukuthi ama-GPU eseva azoba phakathi kwawokuqala ukwamukela lesi sakhiwo.
Source: 3dnews.ru