I-assortment yanoma iyiphi inkampani eyaziwayo ekhiqiza amabhodi omama namuhla ihlanganisa amamodeli amaningi asekela imisebenzi ye-overclocking. Endaweni ethile - ngokwesibonelo, ochungechungeni lwe-ASUS ROG elite - kunenombolo engapheli yemisebenzi enjalo, njengoba nje kunezinye eziningi, kodwa ezinguqulweni ezingabizi kakhulu zamabhodi, ngokuphambene nalokho, abathuthukisi bangeze kuphela i-overclocking eyisisekelo kakhulu. amakhono. Kodwa kunesigaba esincane kakhulu samabhodi omama aklanyelwe ngokuqondile i-overclocking. Azichithiswanga ngokweqile ngezilawuli “ezinesisindo” sokujikeleza, ngokuvamile ezingasekeli inani eliphakeme le-RAM kusethi ethile enengqondo, futhi azikhanyiswa “ngokhaphethi” oqhubekayo wama-LED ku-PCB. Kodwa alungele ukukhama yonke ijusi ngaphandle kwamaphrosesa futhi aklanyelwe ukufinyelela amafrikhwensi aphezulu futhi asethe amarekhodi.
Elinye lala mabhodi likhishwe ngaphezu konyaka odlule ngu-ASRock ngokubamba iqhaza okuqondile kwenganekwane ye-overclocking evela eTaiwan Nick Shih. Ubambe futhi usaphethe amarekhodi amaningana ama-overclocking processors esebenzisa i-nitrogen ewuketshezi, futhi phakathi kwama-overclockers angochwepheshe wabamba indawo yokuqala izinyanga eziyi-18. Kwakuyizincomo zakhe ezisize abathuthukisi ukuthi bakhulule Ifomula ye-ASRock X299 OC, futhi bekungamaphrofayili akhe okweqile okweqile ahlanganiswe ku-BIOS yaleli bhodi.
Namuhla sizojwayelana nezici zaleli bhodi futhi sifunde amakhono alo e-overclocking.
Imininingwane kanye nezindleko
| ASRock X299 OC Ifomula | |
| Amaphrosesa asekelwe | Amaphrosesa we-Intel Core X kunguqulo ye-LGA2066 (isizukulwane sesikhombisa se-Core microarchitecture); ukusekelwa kweTurbo Boost Max Technology 3.0; Isekela ubuchwepheshe be-ASRock Hyper BCLK Engine III |
| Chipset | I-Intel X299 Express |
| Isistimu engaphansi yememori | 4 × DIMM DDR4 inkumbulo engaphazamiseki kuze kufike ku-64 GB; imodi yememori yamashaneli amane noma amabili (kuye ngokuthi iprosesa); ukusekelwa kwamamojula ane-frequency 4600(OC)/4500(OC)/4400(OC)/4266(OC)/4133(OC)/4000(OC)/ 3866(OC)/3800(OC)/3733(OC)/3600(OC)/3200(OC)/2933(OC)/2800(OC)/2666(OC)/2400(OC)/ 2133 MHz; 15-μm othintana nabo abafakwe ngegolide ezindaweni zokukhumbula; I-Intel XMP (Iphrofayili Yenkumbulo Edlulele) 2.0 isekela |
| Izixhumi zamakhadi okunweba | 5 PCI Express x16 3.0 Slots, x16/x0/x0/x16/x8 noma x8/x8/x8/x8/x8 izindlela zokusebenza nge-processor enemizila engu-44 PCI-E; x16/x0/x0/x8/x4 noma x8/x8/x0/x8/x4 enephrosesa enemizila engu-28 PCI-E; x16/x0/x0/x0/x4 noma x8/x0/x0/x8/x4 enephrosesa enemizila engu-16 PCI-E; 1 PCI Express 3.0 x4 slot; 1 PCI Express 2.0 x1 slot; 15-μm abathintwayo abafakwe ngegolide ku-PCI-E1 ne-PCI-E5 slots |
| Ukulinganisa kwesistimu engaphansi kwevidiyo | I-NVIDIA Quad/4-way/3-way/2-way SLI Technology; I-AMD Quad/4-way/3-way/2-way CrossFireX Technology |
| Izixhumanisi zeDrayivu | I-Intel X299 Express Chipset: – 6 × SATA 3, umkhawulokudonsa ofinyelela ku-6 Gbit/s (usekela i-RAID 0, i-RAID 1, i-RAID 5, i-RAID 10, i-Intel Optane Memory, i-Intel Rapid Storage 15, i-Intel Smart Response, i-NCQ, i-AHCI ne-Hot Plug); – 2 × Ultra M.2 (PCI Express x4 Gen 3/SATA 3), umkhawulokudonsa ofinyelela ku-32 Gb/s (zombili izimbobo zisekela izinhlobo zedrayivu 2230/2242/2260/2280/22110). Isilawuli se-ASMedia ASM1061: - 2 × SATA 3, i-bandwidth efika ku-6 Gbit/s (isekela i-NCQ, i-AHCI ne-Hot Plug) |
| Inethiwekhi isikhombimsebenzisi |
Izilawuli ezimbili zenethiwekhi ye-Intel Gigabit LAN I219V ne-I211AT (10/100/1000 Mbit); ukuvikelwa ekuphumeni kombani kanye nokukhishwa kwe-electrostatic (Umbani / Ukuvikelwa kwe-ESD); ukusekelwa kwe-Wake-On-LAN, i-Dual LAN enobuchwepheshe be-Teaming; ukonga amandla i-Ethernet 802.3az, indinganiso ye-PXE |
| I-interface yenethiwekhi engenantambo | No |
| Bluetooth | No |
| Isistimu engaphansi yomsindo | I-Realtek ALC7.1 1220-channel HD codec: - isignali-kumsindo isilinganiso ekuphumeni komsindo womugqa ngu-120 dB, futhi okokufaka komugqa - 113 dB; - Ama-capacitor alalelwayo aseJapan i-Nichicon Fine Gold Series; - I-amplifier ye-headphone eyakhelwe ngaphakathi i-TI NE5532 Premium ephuma kuphaneli yangaphambili (isekela ama-headphone ane-impedance efika ku-600 Ohms); - ukuhlukaniswa kwendawo yomsindo ebhodini le-PCB; - iziteshi zomsindo ezingakwesokunxele nangakwesokudla zitholakala ezingxenyeni ezihlukene zebhodi lesifunda eliphrintiwe; - ukuvikelwa ekukhuphukeni kwamandla; – 15-μm izixhumi zomsindo eziputshwe ngegolide; - Ukusekelwa komsindo we-Premium Blu-ray; - Ukusekelwa kobuchwepheshe bokuvikelwa kwe-Surge and Purity Sound 4; - Ukusekelwa kwe-DTS Connect |
| Isixhumi esibonakalayo se-USB | I-Intel X299 Express Chipset: – 6 USB 3.1 Gen1 izimbobo (4 kuphaneli elingemuva, 2 exhunywe isixhumi ebhodini); - Izimbobo ezi-6 ze-USB 2.0 (ezi-2 kuphaneli elingemuva, ezi-4 ezixhunywe kuzixhumi ezimbili ebhodini). Isilawuli se-ASMedia ASM3142: – 2 izimbobo ze-USB 3.1 Gen2 (Uhlobo A no-Type-C kuphaneli engemuva); Isilawuli se-ASMedia ASM3142: - Imbobo ye-USB 1 Gen3.1 (Uhlobo C lwephaneli yangaphambili yekesi) |
| Izixhumi nezinkinobho kuphaneli elingemuva | 2 USB 2.0 port kanye PS/2 combo port; Inkinobho ye-BIOS Flashback; Sula inkinobho ye-CMOS; 2 USB 3.1 Gen1 izimbobo; 2 USB 3.1 Gen1 izimbobo kanye nesokhethi RJ-45 LAN; 2 USB 3.1 Gen2 izimbobo (Uhlobo-A + Uhlobo-C) kanye nesokhethi RJ-45 LAN; optical S/PDIF okukhiphayo; Ama-jacks alalelwayo ama-5 (Isipikha sangemuva / Maphakathi / Ibhesi / Umugqa ku / Isipikha sangaphambili / Imakrofoni) |
| Izixhumi zangaphakathi ebhodini lesistimu | Isixhumi samandla e-EATX 24-pin high-density; Isixhumi samandla esingu-8-pin high-density ATX 12V; Isixhumi samandla esingu-4-pin high-density ATX 12V; Isixhumi samandla esingu-6-pin high-density ATX 12V samakhadi wevidiyo; 8 SATA3; 2 M.2; Izihloko ezingu-5 zamaphini angu-4 zabalandeli bamakesi/abaphrosesa abanokusekelwa kwe-PWM; Izixhumi ze-LED ze-2 RGB; Isixhumi se-USB 3.1 Gen1 sokuxhuma izimbobo ezimbili; Izixhumi ezi-2 ze-USB 2.0 zokuxhuma izimbobo ezine; Isixhumi se-USB 3.1 Gen2 sembobo kuphaneli engaphambili yekesi; Isixhumi se-TPM; ijekhi yomsindo yephaneli yangaphambili; Isixhumi somsindo se-Engeli Yesokudla; I-RAID ebonakalayo Kusixhumi se-CPU; Izixhumi ze-LED zamandla nezikhulumi; Isixhumi se-Thunderbolt; iqembu lezixhumi zephaneli yangaphambili; Isixhumi sokulawula amandla kagesi; Izinkomba zikaDkt Susa iphutha; Inkinobho yamandla ekhanyisiwe; inkinobho yokusetha kabusha; inkinobho yokuqalisa kabusha (Phinda uzame); Inkinobho ye-Safe Boot; Izinkinobho ezisheshayo ze-OC; Inkinobho yemenyu; PCIe ON/OFF amaswishi; Isihloli Sesimo Sokuthunyelwe (PSC); Shintsha Imodi Enensayo; Ukushintsha kwemodi ye-LN2; I-BIOS B Khetha isixhumi |
| I-BIOS | I-2 × 128 Mbit AMI UEFI BIOS enegobolondo lesithombe esinezilimi eziningi (SD/HD/Full HD); PnP, DMI 3.0 ukwesekwa; I-WfM 2.0, SM BIOS 3.0, ACPI 6.1; ukwesekwa kobuchwepheshe be-Secure Backup UEFI |
| Izici Zesiginesha, Ubuchwepheshe Nezici Ezikhethekile | Ikhithi Yamandla Yefomula ye-OC: - Idizayini yamandla ye-CPU yeSigaba se-13 + idizayini ye-Memory Power yesigaba esi-2; - I-Digi Power (i-CPU neMemori); – UDkt. MOS; Ikhithi Yesixhumi Sefomula ye-OC: - I-Hi-Density Power Connector (24-pin for Motherboard, 8+4 pin for Motherboard, 6-pin for PCIe Slot); – 15μ Gold Contact (amasokhethi enkumbulo kanye PCIE x16 Slots (PCIE1 kanye PCIE5)); Ikhithi yokupholisa yefomula ye-OC: - 8 Layer PCB; - 2 oz ithusi; - Ukwakhiwa Kwepayipi Lokushisa; Ikhithi ye-OC Formula Monitor: - Inzwa ye-Multi Thermal I-ASRock Super Alloy: - Irediyetha ye-aluminium XXL; - I-Premium 60A Power Choke; – 60A Dr.MOS; - premium inkumbulo capacitors; - Ama-capacitor we-Nichicon 12K Black (ama-polymer capacitor angu-100% aphezulu kanye ne-conductivity eyenziwe eJapane); - ibhodi lesekethe elimnyama eliphrintiwe; - High Density Glass Fabric PCB; ASRock Steel Slots; I-ASRock Ultra M.2 (PCIe Gen3 x4 & SATA3); Amandla e-ASRock Ultra USB; I-ASRock Full Spike Protection (yazo zonke izixhumi ze-USB, zomsindo ne-LAN); I-ASRock Live Update & APP Shop |
| operating system | Microsoft Windows 10 x64 |
| Isici sefomu, ubukhulu (mm) | I-ATX, 305×244 |
| Iwaranti umkhiqizi, iminyaka | 3 |
| Intengo encane yokudayisa, hlikihla. | 30 700 |
Ukupakisha kanye nemishini
I-ASRock X299 OC Formula iza ngebhokisi elikhulu, elihlotshiswe ngohlelo lombala oluqinile. Azikho izikrini ezikhanyayo, eziheha iso noma izitikha ohlangothini olungaphambili - kuphela igama lebhodi, umkhiqizi nohlu lobuchwepheshe obusekelwayo.
|
|
|
Ngemuva kwebhokisi ungathola uhlu olufushane lwezici zebhodi nezimbobo zalo kuphaneli elingemuva, futhi ulwazi olugcwele oluphelele lwembulwa ngaphansi kwephaneli engaphambili yebhokisi.
Lapha usungathola cishe lonke ulwazi mayelana nomkhiqizo, futhi ubone iningi lebhodi ngefasitela lepulasitiki elibonakalayo.
Isitika esisekupheleni kwebhokisi sibonisa inombolo ye-serial nenombolo ye-batch, igama lemodeli yebhodi nobukhulu bayo, izwe lokukhiqiza nesisindo.
Sicela uqaphele ukuthi ibhodi inesisindo esingaphezu kwamakhilogremu angu-1,2, ngempela likhulu kakhulu futhi liyasinda.
Ngaphakathi kwebhokisi lekhadibhodi, ibhodi lilele ku-polyethylene foam tray, lapho icindezelwa khona ngezibopho zepulasitiki, futhi enye ifaka eyenziwe ngezinto ezifanayo imboza phezulu.
Iphakheji yokulethwa kwebhodi ihlanganisa izintambo ezine ze-SATA ezinama-latches, i-backplate evamile, iphaneli yangemuva engenalutho, izikulufu ezimbili zokuvikela amadrayivu kuma-slots e-M.2, kanye namabhuloho amane axhumayo okuhlela ukucushwa okuhlukahlukene kwe-SLI.
Kusuka emibhalweni, ibhodi liza nezinhlobo ezimbili zemiyalo equkethe izigaba ngesiRashiya, ipheshana kumaphrosesa asekelwe, ikhadi leposi le-ASRock, idiski elinabashayeli kanye nezinsiza zobunikazi.
I-ASRock X299 OC Formula iza newaranti yeminyaka emithathu. Ngokuqondene nezindleko, eRussia ibhodi lingathengwa ngentengo yama-ruble ayizinkulungwane ezingu-30,7. Ngamanye amazwi, leli elinye lamabhodi omama abiza kakhulu ama-LGA2066 processors.
Izici zokudizayina
Idizayini ye-ASRock X299 OC Formula iqinile, kodwa ngesikhathi esifanayo iyakhanga. Uhlelo lombala webhodi lukhethwa ngendlela yokuthi zonke izakhi zalo, kuhlanganise nama-radiator, zihlanganiswe ngokuvumelana nomunye nomunye. Ngakho-ke, uma uwubheka, uthola umuzwa womkhiqizo ongathi sína futhi wekhwalithi ephezulu, hhayi nje elinye ibhodi “lethoyizi” elinamagajethi amancane akhanyayo ku-PCB.
|
|
|
Ngingathanda ikakhulukazi ukuqaphela ama-radiator amakhulu okupholisa amasekhethi e-VRM wephrosesa, axhunywe ngepayipi lokushisa. I-chipset heatsink, okuphrintwa kuyo igama lemodeli yebhodi, nayo yakhelwe ngesitayela esifanayo.
|
|
|
Ake sengeze ukuthi i-ASRock X299 OC Formula yenziwe nge-ATX form factor futhi inobukhulu obungu-305 × 244 mm.
Indawo ebalulekile yephaneli elingemuva lebhodi lihlala ekugcineni okunezimbambo zesigaba sesibili se-radiator. Ngokusobala, ngesixazululo esilula kangaka, abathuthukisi bafuna ukukhulisa ukusebenza kahle kokupholisa kwezinto ze-VRM. Imininingwane yebhodi ithi le heatsink iyakwazi ukukhipha amandla ashisayo afika kwangu-450 ezintweni ze-VRM.
Naphezu kwaleli qiniso, wonke amachweba adingekayo atholakala kuphaneli elingemuva. Phakathi kwazo kukhona ama-USB ayisishiyagalombili, okuhlanganisa i-3.1 Gen2, imbobo ye-PS/2, izinkinobho ze-BIOS Flashback kanye nezinkinobho ze-Clear CMOS, izindawo zokukhipha amandla ezimbili, i-optical output kanye nokuphuma komsindo okungu-5. Ipulaki ayakhelwe ngaphakathi lapha, njengakwamanye amabhodi omama aphambili.
Okunamathiselwe kuphela ku-ASRock X299 OC Formula amaradiyetha, awekho amakhava epulasitiki akhanyiselwe ngemuva. Ama-radiators avikelwe ngezikulufo, ngakho-ke angasuswa ngaphandle kobunzima obuningi. Yilokhu ibhodi elibukeka ngaphandle kwabo.
Njengamanye amabhodi omama we-ASRock, i-X299 OC Formula isebenzisa i-PCB enezingqimba eziyisishiyagalombili ephezulu, ekwazi ukumelana nokuguquguquka kwamandla kagesi kanye nomswakama ophezulu. Ngaphezu kwalokho, iphinda kabili ubukhulu bezingqimba zethusi, okufanele zibe nomthelela omuhle ekusabalaliseni ukushisa.
Izinzuzo eziyinhloko zebhodi le-ASRock, esizoxoxa ngalo kulo lonke isihloko, zinikezwe ngezansi.
Umdwebo onetafula elivela emiyalweni yokusebenza uzokusiza ukuthi ufunde kabanzi ngokuhlelwa kwezinto ku-PCB.
|
|
|
Kusokhethi ye-LGA2066 processor yebhodi le-ASRock X299 OC Formula, izinaliti zokuxhumana zimbozwe ngesendlalelo segolide esingu-15-μm. Ngokusho kwabathuthukisi, lokhu kunamathela kusiza ukwandisa ukumelana kwezinaliti ekugqwaleni futhi kwandisa inani lezikhathi lapho iprosesa ingasuswa futhi ifakwe ngaphandle kokuwohloka kokuxhumana nayo (okubaluleke kakhulu kuma-overclockers). Ngaphezu kwalokho, phakathi nendawo yesixhumi kukhona umgodi wokufaka inzwa eshisayo ngaphansi kweprosesa.
Njengamanje, ibhodi lisekela amamodeli ayi-17 we-Intel processors akhishwe kumklamo we-LGA2066.
Kuthiwa isifunda samandla eprosesa sakhiwe ngokwesifunda sezigaba eziyi-13, lapho kusetshenziswa khona imihlangano kaDkt. I-MOS, i-Premium 60A Power Choke kanye ne-Nichicon 12K Long Life Capacitors. Amandla aphelele wesekethe yamandla eprosesa asethwe ku-750 A.
|
|
|
Kodwa lapho kuhlolwa ngokucophelela, kuvela ukuthi izigaba ezingu-12 zabelwe ngokuqondile kuphrosesa, kanti enye ihileleke ku-VCCSA (ukuminyanisa kwesokudla esithombeni esibhalwe ukuthi TR30) kanye ne-VCCIO. Ngakolunye uhlangothi lwe-PCB kukhona ama-microcircuits ayisipele, ukusetshenziswa kwawo okuboniswa nokusetshenziswa kwesilawuli se-ISL69138 sezigaba eziyisikhombisa.
Ngaphezu kwalokho, i-ASRock X299 OC Formula inejeneretha yewashi yangaphandle - Hyper BCLK Engine III, esetshenziswa yi-microprocessor ye-ICS 6V41742B.
Kufanele isize ukufeza imiphumela ephezulu ye-overclocking yemvamisa ye-BCLK futhi inikeze ukunemba okwandisiwe kokulungiselelwa kwayo.
Ukuze kunikezwe amandla, ibhodi lalifakwe izixhumi ezine. Lokhu kufaka phakathi okujwayelekile okungu-24- no-8-pin, kanye no-4-pin eyengeziwe wephrosesa nenkumbulo. Hhayi-ke, kunesixhumi samaphini ayisithupha okufanele sixhunywe uma amakhadi evidiyo amane efakwe ebhodini ngesikhathi esisodwa.
|
|
|
Zonke izixhumi zamandla ebhodini zisebenzisa izinaliti zokuxhumana ezixinene kakhulu.
Inani lezikhala ze-RAM ebhodini le-ASRock X299 OC Formula lehlisiwe lisuka kweziyisishiyagalombili laya kwezine, futhi inani eliphezulu lememori esekelwayo ye-DDR4 lehlisiwe lisuka ku-128 laya ku-64 GB. Le ndlela yonjiniyela be-ASRock iyaqondakala futhi inesizathu, ngoba ama-overclockers kumapulatifomu ane-LGA2066 awavamile ukusebenzisa zonke izikhala eziyisishiyagalombili, futhi kulula kakhulu ukuzuza ukudlula inkumbulo okuhlaba umxhwele kusuka kumamojula amane kunayisishiyagalombili. Ama-slots atholakala ngamabili ezinhlangothini zombili zesokhethi ye-processor, bonke othintana nabo ngaphakathi kwabo bambozwe ngesendlalelo segolide esingu-15 μm.
Imvamisa yamamojula ingafinyelela ku-4600 MHz, futhi ukusekelwa kwe-XMP (Extreme Memory Profile) standard 2.0 kuzokwenza ukufeza lesi sibalo kube lula ngangokunokwenzeka, njengoba amakhithi e-DDR4 anefrikhwensi enjalo esengathengwa kakade. Ngendlela, iwebhusayithi yenkampani ishicilele uhlu lwekhithi ye-RAM eqinisekisiwe yaleli bhodi, phakathi kwayo inkumbulo enemvamisa ye-4600 MHz (G.Skill F4-4600CL19D-16GTZKKC). Masingeze ukuthi isistimu yokuphakelwa kwamandla kwepheya ngayinye yezikhala ineziteshi ezimbili.
Kunezikhala eziyisikhombisa ze-PCI Express ku-ASRock X299 OC Formula, futhi ezinhlanu zazo, ezenziwe nge-x16 form factor, zinegobolondo lensimbi eliqinisa ngokwengeziwe lezi zikhala futhi livikele abathintwayo bazo emisebeni kagesi. Ngaphezu kwalokho, ku-slots yokuqala neyesihlanu, othintana nabo ngaphakathi nabo bafakwe ngegolide ngesendlalelo esingu-15 microns.
Uma iphrosesa enemizila engu-44 PCI-E ifakwe ebhodini, isekela ukwakhiwa kwezithombe ezicubungulayo ezivela kumakhadi evidiyo amane ku-AMD noma i-NVIDIA GPU ngemodi ye-x8/x8/x8/x8, futhi amakhadi amabili evidiyo azosebenza inhlanganisela yesivinini esigcwele x16/x16. Ngokulandelayo, ngephrosesa enemizila engu-28 PCI-E, kuyenzeka ukuthi usebenzise amakhadi evidiyo amane ku-AMD GPU ngemodi ye-x8/x8/x8/x4 noma amathathu ku-NVIDIA GPU kumodi ye-x8/x8/x8, namabili. amakhadi evidiyo azohlala esebenza kumodi ye-x16/x8. Ekugcineni, lapho ufaka iphrosesa enemizila engu-16 PCI-E ebhodini, izindlela ze-x16 noma x8/x8 zizotholakala.
Uhlu olukhulu lwama-multiplexers akhiqizwa yi-NXP (izingcezu ezingama-22), ezinye zazo ezitholakala ngemuva kwe-PCB, zinesibopho sokusatshalaliswa kwemigqa ye-PCI-E ebhodini.
Ukwengeza, isilawuli se-ASM1184e esakhiwe yi-ASMedia sishintsha imigqa ye-PCI-Express.
Kuma-peripherals, ibhodi line-PCI Express 3.0 x4 slot elinesiphetho esivulekile kanye ne-PCI Express 2.0 x1 slot eyodwa.
I-chip ye-Intel X299 Express chipset ixhumene ne-heatsink nge-thermal pad futhi ayigqami kunoma yini ekhethekile.
Kungenzeka yini ukuqaphela ukuthi ku-PCB yebhodi, ncamashi eduze komjikelezo we-chipset heatsink, ama-LED ayi-19 RGB anezintambo.
Ibhodi ifakwe amachweba ayisishiyagalombili e-SATA 3, ayisithupha kuwo asetshenziswa kusetshenziswa amakhono e-Intel X299 Express chipset. Basekela ukwakhiwa kwezinhlaka ze-RAID zamazinga 0, 1, 5 no-10, kanye ne-Intel Optane Memory, Intel Rapid Storage 15, Intel Smart Response, NCQ, AHCI kanye nobuchwepheshe be-Hot Plug.
Amachweba amabili engeziwe asetshenziswa isilawuli se-ASMedia ASM1061. Incazelo yokuba khona kwabo ebhodini okuhloswe ngayo u-overclocking ayicacile kithi.
I-ASRock X299 OC Formula ifakwe ngezimbobo ezimbili ze-Ultra M.2 ezinokuphuma okungafika kokungu-32 Gbps, womabili asekela amadrayivu anakho kokubili ukuxhumana kwe-PCI Express x4 Gen 3 kanye ne-SATA 3.
Ubude bokushayela kuwo womabili amachweba bungaba yinoma yikuphi (kusuka ku-30 kuye ku-110 mm), kodwa i-drawback lapha isobala - awekho ama-radiator njengekilasi, nakuba inkinga yokushisa ngokweqile kwama-SSD anesivinini kanye nokwehla okubangelwa ukwehla kwawo. ukusebenza kuhle kakhulu namuhla.
Ukuqhubeka nesihloko samadrayivu, siphawula ukuba khona kwe-Virtual RAID On CPU connector (VROC1) ebhodini.
Iklanyelwe ukudala ama-RAID asheshayo e-hyper-fast asuka kuma-NVMe SSD axhunywe ngqo kusiprosesa.
Kunamachweba we-USB ayi-15 ebhodini - ayisishiyagalombili angaphandle nayisikhombisa angaphakathi. Izimbobo eziyisithupha yi-USB 3.1 Gen1: ezine zitholakala kuphaneli engemuva futhi ezimbili zixhunywe kusixhumi sangaphakathi ebhodini. Amanye amachweba ayisithupha angokwezinga le-USB 2.0: amabili atholakala kuphaneli elingemuva futhi amane axhunywe kuzixhumi ezimbili zangaphakathi ebhodini.
Wonke amachweba asohlwini asetshenziswa amandla e-chipset. Izilawuli ezimbili ezengeziwe ze-ASMedia ASM3142 zenze kwaba nokwenzeka ukungeza izimbobo ezintathu ze-USB 3.1 Gen2 ezinesivinini esikhulu ezinomkhawulokudonsa ofinyelela ku-10 Gbps.
Izimbobo ezimbili ezinjalo zingatholakala kuphaneli engemuva (Izixhumi zohlobo A nezixhumi zohlobo C), kanti enye imbobo itholakala ku-PCB futhi ihloselwe ukuxhuma ikhebula kuyo kusukela kuphaneli yangaphambili yekesi leyunithi yesistimu. Ngokuvamile, inani lamachweba we-USB nokusatshalaliswa kwawo ku-ASRock X299 OC Formula kungabizwa ngokuthi kuhle.
Ibhodi lalifakwe izilawuli ezimbili zenethiwekhi ye-gigabit: Intel WGI219-V kanye ne-Intel WGI211-AT.
Zombili izilawuli nezixhumi zazo zivikelwe ekukhishweni kombani nokuphuma kwe-electrostatic (Umbani/Ukuvikelwa kwe-ESD), futhi zisekela i-Wake-On-LAN, i-Dual LAN enobuchwepheshe be-Teaming kanye nezinga lokonga amandla le-Ethernet 802.3az.
Ngaphandle kokuma okusobala kwe-overclocking ye-ASRock X299 OC Formula, ukunaka okufanele kukhokhwe emsindweni. Indlela yomsindo isuselwe ku-codec yomsindo wesiteshi esingu-7.1 edumile i-Realtek ALC1220.
Ukuze kuthuthukiswe ukuhlanzeka komsindo, yengezwe ngama-capacitor omsindo we-Japanese Nichicon Fine Gold Series kanye ne-TI NE5532 Premium headphone amplifier ephuma nephaneli yangaphambili (isekela ama-headphone ane-impedance efika ku-600 Ohms).
Ngaphezu kwalokho, iziteshi zomsindo ezingakwesokunxele nesokudla zitholakala ezingxenyeni ezihlukene ze-PCB, futhi yonke indawo yengxenye yomsindo ihlukaniswa nebhodi yonke ngemicu engaconductive.
Ukulungiselelwa okunjalo kwehadiwe, ngokusho konjiniyela, kwenze kwaba nokwenzeka ukuzuza isilinganiso sesignali-kuya-kumsindo ekuphumeni komsindo olayini we-120 dB, kanye nokokufaka komugqa - 113 dB. Ezingeni lesofthiwe, ahambisana nePurity Sound 4, DTS Connect, Premium Blu-ray audio, Surge Protection kanye nobuchwepheshe be-DTS Connect.
Imisebenzi yokuqapha nokulawula abalandeli ebhodini yabelwe izilawuli ezimbili ze-Super I/O Nuvoton NCT6683D kanye ne-NCT6791D.
|
|
|
Ngaphezu kwalokho, izilawuli ezimbili ezengeziwe ze-Winbond W83795ADG zidayiswa ohlangothini olungemuva lwebhodi.
Isilawuli ngasinye esinjalo singakwazi ukuqapha ama-voltages angu-21, abalandeli abangu-8 nezinzwa zokushisa ezingu-6. Kodwa kuyamangaza ukuthi ebhodini singathola kuphela izixhumi ezi-5 zokuxhuma nokulawula abalandeli nge-PWM noma i-voltage. Ngokombono wethu, ebhodini lomama lalesi sigaba kanye nokuqondiswa kufanele kube okungenani eziyisikhombisa zalezi zixhumi.
Kodwa ibhodi ifakwe isethi olunzulu izinkinobho overclocking nokushintsha, kanye LEDs ezine zokuxilonga.
Ngaphezu kwalokho, emaphethelweni aphansi e-PCB kukhona inkomba yekhodi ye-POST, onganquma ngayo imbangela yephutha lapho ulayisha noma ukwehluleka kwesistimu.
I-ASRock X299 OC Formula iqukethe ama-chips amabili we-BIOS angu-128.
Ukushintsha phakathi kwama-microcircuits ayinhloko kanye ne-backups kusetshenziswa i-jumper endala enhle. Masingeze ukuthi inkinobho ye-BIOS Flashback ephaneli elingemuva lebhodi ingasetshenziswa ukubuyekeza i-BIOS. Ngaphezu kwalokho, lokhu akudingi iprosesa, i-RAM, noma ikhadi levidiyo - kuphela ibhodi ngokwalo elinamandla axhunyiwe, idrayivu ye-USB enesistimu yefayela ye-FAT32 kanye nenguqulo entsha ye-BIOS.
Njengoba sishilo ngenhla, indawo ye-chipset heatsink ebhodini igqanyisiwe. Umbala we-backlight kanye nemodi yokusebenza ingalungiswa kokubili ku-BIOS nakuhlelo lokusebenza lwe-ASRock RGB LED.
Izixhumi ezimbili ze-RGB zizosiza ukwandisa ukukhanya okungemuva kuwo wonke umzimba weyunithi yesistimu, lapho ungaxhuma khona imichilo ye-LED enomkhawulo wamanje ongu-3 A ngalinye nobude obufika kumamitha amabili.
Ukupholiswa kwezinto zesekethe ye-VRM ku-ASRock X299 OC Formula kusetshenziswa amaradiyetha amabili amakhulu axhunywe ngepayipi lokushisa. I-heatsink ekude inwebela engxenyeni engemuva yebhodi futhi iphinde ipholiswe ukugeleza komoya kwangaphandle.
I-chipset, engashisi kangako, ine-heatsink eyisicaba ye-aluminium ene-thermal pad.
Source: 3dnews.ru