- Ngokuzayo, cishe yonke imikhiqizo ye-Intel izosebenzisa ukwakheka kwendawo ye-Foveros, futhi ukuqaliswa kwayo okusebenzayo kuzoqala ngaphakathi kobuchwepheshe benqubo ye-10nm.
- Isizukulwane sesibili se-Foveros sizosetshenziswa ama-Intel GPU okuqala angu-7nm azothola uhlelo lokusebenza engxenyeni yeseva.
- Emcimbini wabatshalizimali, i-Intel yachaza ukuthi yiziphi izigaba ezinhlanu iphrosesa yaseLakefield ezohlanganisa.
- Ngokokuqala ngqa, izibikezelo zezinga lokusebenza kwalawa ma-processor zishicilelwe.
Ngokokuqala ngqa, i-Intel ikhulume ngedizayini ethuthukisiwe yama-processor ayi-hybrid eLakefield. kulo nyaka, kodwa inkampani isebenzise umcimbi wayizolo kubatshalizimali ukuthi bahlanganise izindlela ezisetshenziswayo ukudala lawa maphrosesa emcabangweni jikelele wokuthuthuka kwenhlangano eminyakeni ezayo. Okungenani, ukwakheka kwendawo ye-Foveros kushiwo emcimbini wayizolo ezimeni ezahlukahlukene - izosetshenziswa, ngokwesibonelo, yi-GPU yokuqala ye-7nm discrete yomkhiqizo, ezothola ukusetshenziswa engxenyeni yeseva ngo-2021.
Ngenqubo ye-10nm, i-Intel izosebenzisa isakhiwo sesizukulwane sokuqala se-Foveros 7D, kuyilapho imikhiqizo engu-2021nm izothuthela kusakhiwo sesizukulwane sesibili se-Foveros. Ngo-XNUMX, ngaphezu kwalokho, i-substrate ye-EMIB izoguqukela esizukulwaneni sesithathu, i-Intel eseyihlolile kumatrices ayo ahlelekayo kanye namaphrosesa eselula e-Kaby Lake-G ahlukile, ahlanganisa ama-Intel computing cores ne-discrete chip yehluzo ze-AMD Radeon RX Vega M. Ngokuvumelana nalokho, ukwakheka okucatshangwayo kwe-Foveros kwamaphrosesa eselula e-Lakefield ngezansi kuhlehlela emuva esizukulwaneni sokuqala.
I-Lakefield: izingqimba ezinhlanu zokuphelela
Emcimbini Umqondisi Wezobunjiniyela uVenkata Renduchintala, u-Intel abona kufanelekile ukumbiza ngesiteketiso esithi “Murthy” kuyo yonke imibhalo esemthethweni, ukhulume ngezigaba eziyinhloko zamaphrosesa eLakefield azayo, okwenze kwaba nokwenzeka ukwandisa kancane ukuqonda kwemikhiqizo enjalo uma kuqhathaniswa noJanuwari. isethulo .
Lonke iphakethe leprosesa yaseLakefield linobukhulu obuyi-12 x 12 x 1 mm, obukuvumela ukuthi udale amabhodi omama ahlangene kakhulu afanele ukubekwa hhayi kumalaptops amancane kakhulu, amaphilisi kanye namadivayisi ahlukahlukene aguqulekayo, kodwa futhi kuma-smartphones asebenza kahle kakhulu. .
Isigaba sesibili siyingxenye yesisekelo, ekhiqizwa kusetshenziswa ubuchwepheshe be-22 nm. Ihlanganisa izici zesethi ye-logic yesistimu, inqolobane yezinga lesithathu elingu-1 MB kanye nesistimu engaphansi yamandla.
Isendlalelo sesithathu sithole igama lawo wonke umqondo wesakhiwo - Foveros. Kuyi-matrix yokuxhumanisa kwe-2.5D okunwebekayo evumela ukuthi ulwazi lushintshwe kahle phakathi kwezigaba eziningi zama-silicon chips. Uma kuqhathaniswa nomklamo webhuloho le-silicon le-3D, umkhawulokudonsa we-Foveros ukhuphuka izikhathi ezimbili noma ezintathu. Lesi sikhombimsebenzisi sinokusetshenziswa okukhethekile kwamandla okuphansi, kodwa kukuvumela ukuthi udale imikhiqizo enamazinga okusetshenziswa kwamandla kusuka ku-1 W kuya ku-XNUMX kW. I-Intel ithembisa ukuthi ubuchwepheshe busesigabeni sokuvuthwa lapho izinga lesivuno liphezulu kakhulu.
Isigaba sesine sinezingxenye ze-10nm: ama-cores amane e-Atom anomnotho anezakhiwo ze-Tremont kanye nenhloko eyodwa enkulu enezakhiwo ze-Sunny Cove, kanye ne-Gen11 ye-graphics subsystem enama-cores okubulala angu-64, abacubunguli be-Lakefield azokwabelana nabo nezihlobo zeselula ze-Ice Lake ze-10nm. Ku-tier efanayo kunezingxenye ezithile ezithuthukisa ukuqhutshwa kokushisa kwalo lonke uhlelo lwe-multi-tier.
Ekugcineni, phezu kwalesi “sandwich” kukhona ama-memory chips amane e-LPDDR4 anomthamo ophelele we-8 GB. Ukuphakama kwabo kokufakwa kusuka esisekelweni akudluli i-millimeter eyodwa, ngakho lonke "ishalofu" livuleke kakhulu, lingekho ngaphezu kwamamilimitha amabili.
Idatha yokuqala ekucushweni kanye nezici ezithile Lakefield
Emibhalweni yaphansi ekukhululweni kwayo kwabezindaba ngoMeyi, i-Intel ikhuluma ngemiphumela yokuqhathanisa iphrosesa enemibandela yeLakefield neprosesa ye-14nm dual-core Amber Lake. Ukuqhathanisa bekusekelwe ekulingiseni nasekufaniseni, ngakho-ke ngeke kushiwo ukuthi i-Intel isivele inawo amasampula wobunjiniyela bamaprosesa aseLakefield. NgoJanuwari, abamele i-Intel bachaza ukuthi ama-10nm Ice Lake processors azoba ngabokuqala ukungena emakethe. Namuhla kwaziwa ukuthi ukulethwa kwalawa ma-processor amalaptops kuzoqala ngoJuni, futhi kumaslayidi esethulweni iLakefield nayo ibiyingxenye yohlu lwemikhiqizo ngo-2019. Ngakho-ke, singathembela ekuqaleni kwamakhompiyutha eselula aseLakefield ngaphambi kokuphela kwalo nyaka, kodwa ukuntuleka kwamasampula wobunjiniyela kusukela ngo-April kuyethusa ngandlela thile.
Ake sibuyele ekucushweni kwamaphrosesa aqhathaniswayo. I-Lakefield kuleli cala yayinama-cores amahlanu ngaphandle kokusekelwa kwezintambo eziningi; ipharamitha ye-TDP ingathatha amanani amabili: ama-watts amahlanu noma ayisikhombisa, ngokulandelana. Ngokuhlangana nephrosesa, inkumbulo ye-LPDDR4-4267 enenani eliphelele elingu-8 GB, emiswe ngomklamo weziteshi ezimbili (2 × 4 GB), kufanele isebenze. Amaphrosesa e-Amber Lake amelwe imodeli ye-Core i7-8500Y enama-cores amabili kanye ne-Hyper-Threading enezinga le-TDP elingekho ngaphezu kuka-5 W namafrikhwensi angu-3,6/4,2 GHz.
Uma ukholelwa ukuthi izitatimende ze-Intel, iphrosesa yaseLakefield inikeza, uma iqhathaniswa ne-Amber Lake, ukuncishiswa kwendawo yebhodi lomama ngesigamu, ukuncipha kokusetshenziswa kwamandla endaweni esebenzayo ngesigamu, ukwanda kokusebenza kwezithombe ngengxenye ezimbili, kanye ukuncipha okuphindwe kashumi kokusetshenziswa kwamandla esimweni sokungenzi lutho. Ukuqhathanisa kwenziwe ku-GfxBENCH naku-SYSmark 2014 SE, ngakho-ke ayizenzi inhloso, kodwa beyanele isethulo.
Source: 3dnews.ru