Ama-smartphones omndeni wakwaHuawei Pura 70 owethulwe ngesonto eledlule ahlome ngokunengqondo ngamaphrosesa esimanje kakhulu e-HiSilicon edizayini yawo, kanti ezikhulwini zaseMelika ubuqili bekuwukuthi i-SMIC iwagcinile yini amandla okukhiqiza ama-chips angu-7-nm ngaphansi kwezigwegwe. Ngokusho kochwepheshe bezinkampani zangaphandle, ama-processor we-7nm aphinde abonakale ngaphakathi kwama-smartphones amasha eHuawei. Umthombo wesithombe: IHuawei Technologies
Source: 3dnews.ru