Ukukhiqizwa kwe-Samsung B-die memory chips kumisiwe

Amamojula enkumbulo akhelwe kuma-chips e-Samsung B-die mhlawumbe angenye yezinketho ezidume kakhulu phakathi kwabathandi. Kodwa-ke, umkhiqizi waseNingizimu Korea uzibheka njengeziphelelwe yisikhathi futhi okwamanje umisa ukukhiqizwa kwazo, enikeza ukushintshwa kwamanye ama-memory chips e-DDR4, ukukhiqizwa kwawo okusebenzisa izinqubo zobuchwepheshe ezintsha. Lokhu kusho ukuthi amamojula enkumbulo e-DDR4 e-Samsung angasetshenziswanga asekelwe kuma-chip e-B-die manje asefinyelele ekupheleni komjikelezo wawo wokuphila futhi azophela esitokweni maduze. Abanye abakhiqizi abasebenzisa ama-Samsung B-die chips emikhiqizweni yabo nabo bazoyeka ukuhlinzeka ngamamojula afanayo.

Ukukhiqizwa kwe-Samsung B-die memory chips kumisiwe

Ama-Samsung B-die chips namamojula enkumbulo asekelwe kuwo azuze ukuqashelwa okubanzi ngenxa yokuguquguquka kwawo kanye namandla okudlula ngokweqile. Zilinganisa kahle kakhulu kumafrikhwensi, zisabela kahle ekwenyukeni kwamandla kagesi futhi zivumela ukusebenza ngezikhathi ezinolaka kakhulu. Inzuzo ehlukile ebalulekile yamamojula asekelwe kuma-chips e-Samsung B-die ukuzithoba kwawo nokuhambisana okubanzi nezilawuli zememori ezihlukahlukene, ezithandwa kakhulu ngabanikazi bezinhlelo ezisekelwe ku-Ryzen processors.

Kodwa-ke, ekukhiqizeni ama-chips e-B-die, kusetshenziswa inqubo yezobuchwepheshe endala enamazinga angama-20 nm, ngakho-ke isifiso se-Samsung sokuyeka ukukhiqizwa kwamadivayisi anjalo we-semiconductor sivumela ezinye izindlela zesimanjemanje siyaqondakala. Esikhathini esingeside esidlule, inkampani imemezele ukuqala kokukhiqizwa kwama-DDR4 SDRAM chips kusetshenziswa ubuchwepheshe be-1z-nm (isizukulwane sesithathu), nama-chips akhiqizwa kusetshenziswa ubuchwepheshe be-1y-nm (isizukulwane sesibili) akhiqizwa isikhathi esingaphezu konyaka nesigamu. Yilezi umkhiqizi akukhuthaza ukuthi ushintshele kuzo. Ama-B-die chips anikezwe ngokusemthethweni isimo se-EOL (End of Life) - ukuphela komjikelezo wempilo.

Ukukhiqizwa kwe-Samsung B-die memory chips kumisiwe

Esikhundleni sama-chips e-Samsung B-die adumile, okunye okunikezwayo manje kuzosatshalaliswa. Ama-chips e-M-die, adalwe kusetshenziswa ubuchwepheshe benqubo ye-1y nm, afinyelele esigabeni sokukhiqiza ngobuningi. Ama-chips e-A-die, akhiqizwa kusetshenziswa ubuchwepheshe obuthuthuke kakhulu namazinga we-1z nm, nawo asefinyelele esigabeni sokukhiqiza iziqu. Lokhu kusho ukuthi inkumbulo kuma-M-die chips izothengiswa maduze nje, futhi amamojula akhelwe kuma-A-die chips azotholakala kubasebenzisi phakathi nezinyanga eziyisithupha.


Ukukhiqizwa kwe-Samsung B-die memory chips kumisiwe

Inzuzo eyinhloko yama-memory chips amasha anama-cores abuyekeziwe, ngaphezu kwezinqubo zesimanje zobuchwepheshe namandla okungenzeka aphakeme ama-frequency, futhi amandla awo anyukile. Bavumela ukukhiqizwa kwamamojula wememori ye-DDR4 enohlangothi olulodwa anomthamo we-16 GB kanye namamojula anezinhlangothi ezimbili ezinomthamo we-32 GB, okwakungenakwenzeka ngaphambili.

Kuyafaneleka ukukhumbula ukuthi kuleli hlobo singalindela izinguquko ezibalulekile kuhlu lwamamojula wememori we-DDR4 SDRAM atholakala emakethe. Ngokungeziwe kuma-Samsung chips amasha, ama-E-die chips avela kwaMicron kanye ne-C-die avela kwa-SK Hynix nawo kufanele asetshenziswe emigqeni yenkumbulo. Kungenzeka ukuthi zonke lezi zinguquko zizobangela ukwanda hhayi kuphela kumthamo ojwayelekile, kodwa futhi namandla okuvama kwamamojula we-DDR4 SDRAM.



Source: 3dnews.ru

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