Eminyakeni yamuva, bonke abathuthukisi be-central and graphic processors bebelokhu befuna izixazululo ezintsha zesakhiwo. Inkampani ye-AMD okuthiwa "ama-chiplets" okuvela kuwo ama-processor ane-architecture ye-Zen 2: amakristalu amaningana angu-7-nm kanye ne-crystal eyodwa ye-14-nm ene-I / O logic kanye nezilawuli zememori zitholakala ku-substrate eyodwa. I-Intel ekuhlanganiseni kwenye substrate eyodwa sekunesikhathi eside ikhuluma futhi yaze yasebenzisana ne-AMD ukwenza amaphrosesa e-Kaby Lake-G ukuze abonise amanye amaklayenti ukusebenza kwalo mbono. Ekugcineni, ngisho ne-NVIDIA, i-CEO yayo eziqhenyayo ngekhono lonjiniyela lokwakha amakristalu e-monolithic osayizi ongakholeki, isezingeni. kanye nemiqondo yesayensi, ukuthi kungenzeka ukusebenzisa ukuhlelwa kwe-multi-chip nakho kucatshangelwa.
Ngisho nasengxenyeni elungiselelwe kusengaphambili yombiko engqungqutheleni yokubika yekota, inhloko ye-TSMC, u-CC Wei, ugcizelele ukuthi inkampani yakha izixazululo zesakhiwo esinezinhlangothi ezintathu ngokubambisana βnabaholi abaningi bezimboni,β kanye nokukhiqizwa ngobuningi balokho. imikhiqizo izokwethulwa ngo-2021. Isidingo sezindlela ezintsha zokupakisha akuboniswa kuphela ngamakhasimende emkhakheni wezixazululo ezisebenza kahle kakhulu, kodwa futhi ngabathuthukisi bezingxenye zama-smartphones, kanye nabamele imboni yezimoto. Inhloko ye-TSMC iyaqiniseka ukuthi ngokuhamba kweminyaka, izinsizakalo zokupakishwa kwemikhiqizo ye-XNUMXD zizoletha imali eyengeziwe enkampanini.
Amakhasimende amaningi e-TSMC, ngokusho kuka-Xi Xi Wei, azozibophezela ekuhlanganiseni izingxenye ezihlukene esikhathini esizayo. Kodwa-ke, ngaphambi kokuba umklamo onjalo usebenze, kuyadingeka ukuthi kuthuthukiswe isixhumi esibonakalayo esisebenzayo sokushintshanisa idatha phakathi kwama-chips ahlukene. Kumele ibe nokuphuma okuphezulu, ukusetshenziswa kwamandla okuphansi nokulahlekelwa okuncane. Esikhathini esizayo esiseduze, ukunwetshwa kwezindlela zokuhlela ezinezinhlangothi ezintathu kumthumeli wokuthutha we-TSMC kuzokwenzeka ngesivinini esilinganiselwe, kufingqa i-CEO yenkampani.
Abamele i-Intel basanda kusho engxoxweni ukuthi enye yezinkinga eziyinhloko zokupakishwa kwe-XNUMXD ukuchithwa kokushisa. Izindlela ezintsha zokupholisa amaphrosesa esikhathi esizayo nazo ziyacatshangelwa, futhi ozakwethu be-Intel bakulungele ukusiza lapha. Eminyakeni engaphezu kweyishumi edlule, IBM sebenzisa uhlelo lweziteshi ezincane zokupholisa uketshezi lwamaphrosesa amaphakathi, kusukela ngaleso sikhathi inkampani yenze inqubekelaphambili enkulu ekusetshenzisweni kwezinhlelo zokupholisa uketshezi engxenyeni yeseva. Amapayipi okushisa ezinhlelweni zokupholisa ze-smartphone nawo aqala ukusetshenziswa cishe eminyakeni eyisithupha edlule, ngakho-ke ngisho namakhasimende alondoloza kakhulu akulungele ukuzama izinto ezintsha lapho ukumiswa kuqala ukubakhathaza.
Ukubuyela ku-TSMC, kungaba kuhle ukwengeza ukuthi ngesonto elizayo inkampani izoba nomcimbi eCalifornia lapho izokhuluma khona ngesimo ngokuthuthukiswa kwezinqubo zobuchwepheshe ze-5-nm kanye ne-7-nm, kanye nezindlela ezithuthukisiwe zokukhweza. imikhiqizo ye-semiconductor ibe amaphakheji. Izinhlobonhlobo ze-XNUMXD nazo ziku-ajenda yomcimbi.
Source: 3dnews.ru