I-TSMC yaseTaiwanese semiconductor yamemezela ukuthi isiqedele ngokugcwele ukuthuthukiswa kwengqalasizinda yenqubo ye-5nm ngaphansi kwe-Open Innovation Platform, okuhlanganisa amafayela ezobuchwepheshe kanye nezinsiza zokuklama. Inqubo yobuchwepheshe idlule izivivinyo eziningi zokuthembeka kwama-silicon chips. Lokhu kuvumela ukuthuthukiswa kwama-5nm SoCs esizukulwaneni esilandelayo sezixazululo zeselula nezisebenza kakhulu eziqondiswe ku-5G ezikhula ngokushesha nezimakethe zobuhlakani bokwenziwa.
Ubuchwepheshe benqubo ye-TSMC ye-5nm sebuvele bufinyelele esigabeni sokukhiqiza ubungozi. Isebenzisa umnyombo we-ARM Cortex-A72 njengesibonelo, uma kuqhathaniswa nenqubo ye-TSMC engu-7nm, ihlinzeka ngokuthuthuka okuphindwe ka-1,8 ku-die density kanye nokuthuthukiswa kwamaphesenti angu-15 kwejubane lewashi. Ubuchwepheshe be-5nm busebenzisa ithuba lokwenza lula inqubo ngokushintshela ngokuphelele ku-lithography ye-ultraviolet (EUV) eyeqisayo, okwenza inqubekelaphambili enhle ekwenyuseni izinga lokuvunwa kwama-chip. Namuhla, ubuchwepheshe bufinyelele izinga eliphezulu lokuvuthwa uma kuqhathaniswa nezinqubo zangaphambilini ze-TSMC esigabeni esifanayo sokuthuthuka.
Yonke ingqalasizinda ye-TSMC ye-5nm isiyatholakala ukuze ilandwe. Ngokusebenzisa izinsiza ze-ecosystem yomklamo ovulekile womkhiqizi waseTaiwan, amakhasimende aseqalile ukuthuthukiswa kokuklama okujulile. Ihlangene nozakwethu i-Electronic Design Automation, inkampani iphinde yengeza elinye izinga lesitifiketi sokugeleza komklamo.
Source: 3dnews.ru