Ku-CEO ye-AMD uLisa Su, kulo nyaka kuzoba isikhathi sokuqashelwa okuthile, njengoba engakhethwanga nje kuphela njengosihlalo we-Global Semiconductor Alliance, kodwa futhi uthola njalo ithuba lokuvula imicimbi ehlukahlukene yezimboni. Kwanele ukukhumbula iComputex 2019 - bekuyinhloko ye-AMD ethole udumo lokwethula inkulumo ngesikhathi kuvulwa lo mbukiso omkhulu wezimboni. Umcimbi wegeyimu i-E3 2019, ozoba engxenyeni yokuqala kaJuni, ngeke ubonakale ungabonwa; kunezizathu eziningi zokukholelwa ukuthi ngesikhathi sokusakazwa kwezihloko, inhloko ye-AMD kanye nozakwabo bazokhuluma okokuqala ngokuvulelekile mayelana nemidlalo. Izixazululo zehluzo ze-7nm Navi, isimemezelo sazo esihlelelwe ikota yesithathu.
Imicimbi yemboni yasehlobo lapho uLisa Su amenywe khona ayikhawulelwe kulolu hlu. I-ajenda esanda kukhishwa yengqungquthela ka-Agasti
Ngendlela, ngo-Agasti 21 kulo nyaka, abamele i-AMD bazokhuluma ngama-Navi GPUs kuma-Hot Chips. Konke lokhu kusikisela ukuthi ngaleso sikhathi bazothola isimo semikhiqizo ye-serial. Njengoba kusanda kwaziwa, engxenyeni yesithathu, abameleli balo mdwebo bazonikezwa kuzo zombili izingxenye zokudlala neseva. Kungenzeka ukuthi ngo-Agasti i-AMD izokhuluma nge-Navi emongo wokugcina. Ngaphezu kwalokho, sizokhuluma ngamaphrosesa aphakathi anezakhiwo zeZen 2.
I-Intel izobuyela esihlokweni sesakhiwo sendawo futhi I-Foveros
Abamele i-Intel Corporation bazokwenza izethulo kuphela engxenyeni esebenzayo yengqungquthela ye-Hot Chips, futhi isihloko esithakazelisa kakhulu sihlala singamasheshi e-Spring Hill ezinhlelo zokufunda, ezizosetshenziswa engxenyeni yeseva ukwakha amasistimu akwazi ukwenza iziphetho ezinengqondo. Kule ndawo, i-Intel isebenzisa ngenkuthalo ukuthuthukiswa kwenkampani eyithengile, i-Nervana, kodwa imikhiqizo ewumongo ivamise ukuvela ngaphansi kwezimpawu ezigcina ngokuthi “Crest” (Lake Crest, Spring Crest kanye ne-Knights Crest). Ukuqokwa kwe-Spring Hill kungase kubonise isakhiwo esiyingxubevange esihlanganisa ukuthuthukiswa kwe-Intel kwe-Xeon Phi kanye "nefa le-Nervana".
Ngendlela, abamele i-Intel bazophinde bakhulume ngama-accelerator e-Spring Crest kuma-Hot Chips. Ngaphezu kwalokho, bazonikeza isethulo kuma-Intel Optane SSD. Omunye wemibiko ye-Intel uzonikelwa ekwakhiweni kwamaphrosesa ayingxube anama-heterogeneous cores kusetshenziswa ukwakheka kwendawo. Impela i-Intel izobuyela kumqondo we-Foveros, ezowusebenzisa lapho ikhulula amaphrosesa we-10nm Lakefield ngezinga eliphezulu lokuhlanganisa. Nokho, singase sizwe nangemikhiqizo yesikhathi esizayo enalolu hlobo lwesakhiwo sendawo.
I-TSMC izokwabelana ngezinhlelo zokuthuthukiswa kwe-lithography yeminyaka ezayo
ULisa Su ngeke kube nguyena yedwa isikhulu esizohlonishwa ngokukhuluma engqungqutheleni yeHot Chips. Ilungelo elifanayo lizonikezwa iPhini Likamongameli Wezokuthuthukiswa Nokucwaninga we-TSMC uPhilip Wong. Uzokhuluma ngemibono yenkampani ekuthuthukisweni okuqhubekayo kwemboni, futhi uzozama ukubheka ngalé kobuchwepheshe be-lithographic obunamazinga angaphansi kwe-nanometer eyodwa. Kusukela kusichasiselo kuya enkulumweni yakhe, sifunda ukuthi ngemuva kobuchwepheshe benqubo ye-3nm, i-TSMC ilindele ukunqoba ubuchwepheshe benqubo ye-2nm ne-1,4 nm.
Abanye abahlanganyeli bengqungquthela nabo baveze izihloko zemibiko yabo. I-IBM izokhuluma ngesizukulwane esilandelayo se-POWER processors, iMicrosoft izokhuluma ngesisekelo se-Hardware se-Hololens 2.0, futhi i-NVIDIA izobamba iqhaza embikweni we-neural network accelerator ene-multi-chip layout. Vele, inkampani yokugcina ayikwazi ukumelana nokukhuluma ngokulandela umkhondo we-ray kanye nesakhiwo se-Turing GPU.
Source: 3dnews.ru