Ngokusho kwesinyathelo esisha, iMelika , izinkampani ezisebenzisana neHuawei zinezinsuku eziyikhulu namashumi amabili zokuthola ilayisense ekhethekile ezivumela ukuthi ziqhubeke nale misebenzi emkhakheni wezobuchwepheshe. Ngemuva kwalokhu, kulindeleke ukuthi i-TSMC ngeke ikwazi ukuhlinzeka i-Huawei ngamaphrosesa enziwe ngokwezifiso i-HiSilicon engaphansi kwayo.
Ngokwemvelo, ngenkathi uHuawei ezama ukuqinisa amakhasimende ngemibiko yokuba khona kwemithombo ebalulekile yezingxenye zeziteshi eziyisisekelo zamanethiwekhi okuxhumana e-5G, kodwa ngolunye usuku zizoqedwa, futhi ingcindezi yeziphathimandla zaseMelika, ngokusobala, ayisoze yaba buthaka. UHuawei uthathwa njengekhasimende lesibili ngobukhulu kwa-TSMC ngemuva kwe-Apple, kanti umdondoshiya waseShayina ungabalelwa ku-15% wemali engenayo yosonkontileka baseTaiwan. Njengoba i-TSMC ithembele kumishini nobuchwepheshe bomsuka waseMelika, imigomo emisha yokusebenzisana neHuawei yenza kungenzeki.
Ezinyangeni ezedlule, izinsiza zezindaba zivame ukuphendukela esihlokweni sokubambisana phakathi kweHuawei ne-SMIC, ezinze eShanghai. Kuthiwa amanye amaphrosesa eselula e-HiSilicon asanda kukhiqizwa yi-SMIC esebenzisa ubuchwepheshe obuphambili kakhulu be-14-nm bosonkontileka baseChina. Ngokweminye imibiko, lawa mazinga obuchwepheshe ahlinzeka ngenani elingaphezudlwana kwephesenti elilodwa lemali engenayo ye-SMIC; le nkampani ngeke isakwazi ukwanelisa ngokugcwele izidingo zikaHuawei.
Uhlelo ichaza ukuthi i-SMIC iphinde isebenzisa imishini evela kubahlinzeki baseMelika kanye nesofthiwe yaseMelika emsebenzini wayo. Ngakho-ke, ukuvinjelwa kokubambisana neHuawei kuyasebenza naku-SMIC, ngakho-ke abokuqala ngeke bakwazi ukuthola insindiso emgqeni womhlangano wesibili.
Abahlinzeki bakwamanye amazwe bezingxenye ze-Huawei ezifana ne-Samsung, i-SK Hynix ne-Kioxia (ngaphambili eyayiyi-Toshiba Memory) abekho ngaphansi kwezinhlawulo zase-US kuphela uma bengayisizi inkampani yase-China ukuthi ithuthukise futhi yethule ukukhiqizwa kwamaphrosesa ayo. Ngakho-ke, i-Samsung ingahlinzeka i-Huawei ngama-memory chips, kodwa ayikwazi ukukhiqiza amaphrosesa azowa-oda kuleli khasimende. Okwamanje, izenzo zase-US zinqamula ukufinyelela kukaHuawei kubuchwepheshe be-lithography obuthuthukisiwe.
Source: 3dnews.ru