nge-architecture entsha yezithombe, i-RDNA yethulwa nomfowabo omncane ngoJulayi walo nyaka. Kakade ekuqaleni kuka-Agasti, i-XFX ilungisiwe nge-THICC II epholile ekabili kumklamo wakudala wesiginesha ogqugquzelwe izimoto zamaphakathi nekhulunyaka.
Futhi ekuqaleni kuka-Okthoba, i-XFX ikhiphe i-accelerator efanayo kanye namafrikhwensi akhuphuke kakhulu uma kuqhathaniswa nalawo ayisisekelo. Ummeleli we-XFX usanda kukhuluma ngezizathu zokubuyekezwa kwesistimu yokupholisa kanye nezinguquko ezenziwe.
Ngaphezu kwenani labalandeli likhuphuke lisuka ku-2 laya ku-3, irediyetha enamaphiko e-aluminium nayo yandiswa kancane, futhi okubaluleke nakakhulu, i-aluminium asizayo pad, ebhekene nokukhipha ukushisa kusuka ku-8 GDDR6 memory chips, nayo yaba yithusi. Uhlelo lokupholisa lwe-THICC III luphinde lwasusa ucwecwe lwensimbi phakathi kwale padi ne-heatsink eyinhloko.
Izinguquko ezilula ezinjalo zenze kwaba nokwenzeka ukwehlisa izinga lokushisa lenkumbulo ngamadigri angu-8 uma kuqhathaniswa nepholile yokuqala ye-THICC II. Ukwanda kokugeleza komoya okuvela kubalandeli abathathu nakho kube nesandla. Kodwa, ngaphezu kwakho konke, kwakuyizinto ezibonakalayo zephedi lokuxhumana kanye nokususwa kwe-foil okwenza kube nokwenzeka ukufeza umphumela.
Ummeleli we-XFX umemezele ukuthi amakhadi amasha ezithombe ze-RX 5700 XT THICC II nawo afaka lezi zinguquko zokwakheka. Ngaphezu kwalokho, bonke abathengi bama-accelerator esitayela esidala bangathinta i-XFX ukuze bathathelwe indawo mahhala ikhadi levidiyo ngokubuyekezwa kwamanje. Kodwa-ke, akucaci ukuthi kungenzeka yini ukuhlukanisa ukubuyekezwa ngokubonakala kwekhadi levidiyo?
Ngakho-ke, ukuthuthukiswa okwenziwe kufanele kubhekwe njengokulungiswa kwamaphutha okuklama, kuyilapho ukunikeza ukushintshwa kwamahhala kuhloswe ukunciphisa izindleko zesithunzi.
Source: 3dnews.ru