Ilaha shabakadu waxay ku waramayaan in HiSilicon, oo ah shirkad soo saarta Chip oo ay leedahay Huawei, ay doonayso inay xoojiso horumarinta Chipset-yada mobilada oo leh modem 5G ah oo isku dhafan. Intaa waxaa dheer, shirkaddu waxay qorsheyneysaa inay adeegsato tikniyoolajiyadda millimeter wave (mmWave) marka la soo bandhigo chipset-ka cusub ee casriga ah ee 5G dhamaadka 2019.
Horaantii, waxaa jiray warar ku saabsan internetka oo sheegaya in qeybtii labaad ee sanadkan, Huawei uu soo saari doono processor cusub oo mobile ah, HiSilicon Kirin 985, kaas oo heli doona taageerada shabakadaha 4G, sidoo kale waxaa lagu qalabeyn doonaa Balong 5000 modem, taas oo u ogolaanaysa qalabka si uu ugu shaqeeyo jiilka shanaad (5G) shabakadaha isgaarsiinta. Chip-ka gacanta ee Kirin 985, oo ay soo saari doonto shirkadda Taiwanese ee TSMC, ayaa laga yaabaa in uu ka soo muuqdo taxanaha cusub ee Huawei Mate 30 ee casriga ah ee casriga ah ee Huawei ay u badan tahay in la soo bandhigo rubuci afraad ee 2019ka.
Chip mobile-ka cusub ee HiSilicon ayaa la tijaabin doonaa rubuci labaad ee sanadkan, waxaana daah-furka wax soo saarkiisa baaxadda leh uu dhici doonaa rubuci saddexaad ee 2019ka. Ilaha shabakadda ayaa sheegaya in chips-yada mobilada cusub ee leh modem 5G-ga ah ay bilaabi doonaan in la sii daayo dhammaadka 2019 ama horraanta 2020. Waxaa la filayaa in Processor-radan ay saldhig u noqon doonaan talefannada casriga ah ee cusub oo ay iibiyuhu Shiinuhu qorsheynayo inuu ku galo xilliga 5G.
Qualcomm iyo Huawei waxay ku tartamayaan qayb ay shirkad kastaa isku dayayso inay noqoto alaab-qeybiyaha ugu horreeya ee chips-ka oo leh modem 5G ah oo isku dhafan. Shirkadda Taiwanese MediaTek ayaa sidoo kale la filayaa inay soo bandhigto processorkeeda 5G dhamaadka 2019, halka Apple aysan u badnayn inuu tan sameeyo ka hor 2020.
Source: 3dnews.ru
