U-Intel ujoyine i-CHIPS Alliance futhi wanika umhlaba i-Advanced Interface Bus

Amazinga avulekile athola ukwesekwa okwengeziwe. Iziqhwaga ze-IT ziphoqelekile ukuthi zingagcini nje ngokubheka lesi simo kodwa futhi zifake isandla ekuthuthukisweni kwazo okuyingqayizivele emiphakathini yemithombo evulekile. Isibonelo sakamuva wumnikelo webhasi le-Intel AIB ku-CHIPS Alliance.

Kuleli sonto, Intel waba yilungu le-CHIPS Alliance (Izingxenyekazi zekhompuyutha Ezivamile Zokusebenzelana, Amaprosesa, kanye Nezinhlelo). Njengoba isifinyezo se-CHIPS siphakamisa, le nhlangano yemboni isebenza ekuthuthukiseni izixazululo eziningi zomthombo ovulekile zama-SoCs kanye nokupakishwa kwama-chip asondelene kakhulu, njenge-SiP (isistimu-in-amaphakheji).

Njengoba eseyilungu lomfelandawonye, ​​u-Intel wanikela ngebhasi eyayidalile emphakathini. Ibhasi le-Advanced Interface (AIB). Vele, lokhu akukhona ukucabangela nje kuphela: kuyilapho ibhasi le-AIB lizovumela noma ubani ukuthi akhe izixhumanisi ze-interchip ezisebenza kahle ngaphandle kokukhokha izinzuzo ku-Intel, inkampani futhi inethemba lokukhulisa ukuthandwa kwama-chiplets ayo.

Ibhasi le-AIB lakhiwa yi-Intel ngaphansi kohlelo lwe-DARPA. Amasosha ase-US kudala anentshisekelo kumqondo odidiyelwe kakhulu ohlanganisa ukufa okuningi. Le nkampani yethula isizukulwane sokuqala sebhasi le-AIB ngo-2017. Emuva ngaleso sikhathi, izinga ledatha lafinyelela ku-2 Gbps kumzila owodwa. Isizukulwane sesibili sebhasi ye-AIB yethulwa ngonyaka odlule. Izinga ledatha likhuphukele ku-5,4 Gbps. Ngaphezu kwalokho, ibhasi le-AIB linikeza ukuminyana kwesilinganiso sedatha esingcono kakhulu ngemm ngayinye: 200 Gbps. Lena ipharamitha ebalulekile yamaphakheji e-multi-die.

Kubalulekile ukuqaphela ukuthi ibhasi le-AIB liyinqubo futhi lizimele. Ingasetshenziswa ku-Intel's EMIB spatial multi-chip package, iphakethe le-TSMC eliyingqayizivele le-CoWoS, noma okunye ukupakisha okuvela eceleni. Ukuguquguquka kwesixhumi esibonakalayo kuzozuzisa kakhulu amazinga avulekile.

Ngesikhathi esifanayo, kuhle ukukhumbula ukuthi omunye umphakathi ovulekile, i-Open Compute Project, nayo ithuthukisa ibhasi layo lokuxhuma ama-chiplets (amakristalu). Leli ibhasi le-Open Domain-Specific Architecture (I-ODSA). Iqembu elisebenzayo lokudala i-ODSA lidalwe kamuva nje, ngakho-ke ukungena kwe-Intel ku-CHIPS Alliance kanye nokudluliselwa kwebhasi le-AIB emphakathini kungase kube isinyathelo sokuqala.

Source: 3dnews.ru