Imininingwane ye-Xiaomi Mi CC9 Pro iqinisekisiwe: i-NFC, i-infrared transmitter nokunye

Sisanda kubika imininingwane enemininingwane idivayisi ethakazelisa kakhulu ye-Xiaomi Mi CC9 Pro ene-pentacamera (kuhlanganise nenzwa engu-108-megapixel), ezomenyezelwa ngoNovemba 5 (futhi cishe izokhishwa emakethe yamazwe ngamazwe ngomhla ka-15 ngaphansi kwegama elithi Mi Note 10). Inkampani useyivezile imininingwane Mayelana nezinzwa zekhamera, ukuqina kwesithombe esikabili, i-chip ye-Snapdragon 730G, ibhethri elingu-5260 mAh elinokushaja okusheshayo okungu-30W, inzwa yezigxivizo zeminwe ezingaboniswa ngaphansi kwesibonisi, nokunye okuningi.

Manje, umkhiqizi unqume ukuveza imininingwane eyengeziwe mayelana nedivayisi. Isibonelo, kuzoba i-smartphone yokuqala emhlabeni ukufaka isithwebuli sezigxivizo zeminwe esincanyana kakhulu, esikhulisa ukunemba kwenzwa nokuzwela. Ukuvula idivayisi kuzoba lula ngisho nasemazingeni okushisa aphansi ngeminwe eyomile.

Okwesibili, idivayisi ifakwe ukwesekwa kwe-NFC, ngakho-ke labo abathanda ukusebenzisa i-smartphone yabo njengendlela yokukhokha bangase bafune ukucabangela lesi sixazululo. Enye inzuzo ephawulekayo i-infrared emitter ehlanganisiwe phezulu yokulawula izinto zikagesi zasendlini zisebenzisa uhlelo lokusebenza lwe-Mi Remote.

Ngaphezu kwalokho, i-Xiaomi igcizelela amakhono omsindo: isibonelo, idivayisi ifakwe ikamelo elikhulu le-acoustic elinomthamo we-cubic centimeter eyodwa, ethembisa ukuletha kabili umthamo wesizukulwane esedlule. Ngaphezu kwalokho, idivayisi igcina ijekhi yomsindo engu-3,5 mm futhi isekela umsindo we-Hi-Res wekhwalithi ephezulu.

Ukucaciswa okulindelekile kwe-Xiaomi Mi CC9 Pro:

• Isibonisi se-AMOLED esingu-6,47-intshi esinokulungiswa kwe-Full HD+ (amaphikseli angu-2340 × 1080) nemiphetho egobile;
• 8-core Snapdragon 730G chip (2 enamandla 2,2 GHz cores + 6 amandla ayonga 1,8 GHz) ne-Adreno 618 graphics processor;
• 6/8/12 GB ye-LPPDDR4x RAM ebhangqwe ne-64/128/256 GB ye-UFS 2.1 isitoreji;
• ukusekelwa kwamakhadi amabili e-SIM (nano + nano);
• Android 10 enegobolondo le-MIUI 11;
• Imojuli eyinhloko engu-108-megapixel enenzwa ye-Samsung HMX engu-1/1,33-intshi, usayizi wamaphikiseli angu-0,8 μm, indawo yokuvula i-f/1,69, i-OIS; isithombe esinenzwa engu-12-megapixel 1/2,6-intshi, 1,4 μm, i-autofocus yokuthola izigaba ezimbili, i-zoom yokubona engu-2x; Ilensi yocingo engu-5-megapixel ene-5x optical ne-10x hybrid zoom ne-OIS; Imojula engu-20-megapixel ultra-wide-angle ene-engeli yokubuka engu-117°; I-2-megapixel macro lens yokudubula kusuka ebangeni elingu-1,5 cm; kabili LED flash.
• Ikhamera yangaphambili engu-32 MP etholakala kusikwe esibukweni;
• inzwa yezigxivizo zeminwe ezisesikrinini;
• i-infrared emitter;
• Ijekhi yomsindo engu-3,5mm, umsindo we-Hi-Res;
• Ubukhulu 157,8 × 74,2 × 9,67 mm, isisindo 208 amagremu;
• I-Dual 4G VoLTE, Wi-Fi 802.11ac (2,4 GHz + 5 GHz), Bluetooth 5, GPS + GLONASS, NFC, USB Type-C;
• 5260 mAh ibhethri elisekelwa ukushaja okusheshayo okungu-30W.

I-smartphone izothengiswa ngemibala eluhlaza nemhlophe, kanti intengo yemakethe yaseChina izomenyezelwa ngoNovemba 5.

Source: 3dnews.ru