Samsung Electronics has announced the mass production of next-generation RAM modules for future flagship smartphones and phablets.
We are talking about products LPDDR4X (Low-Power Double Data Rate 4X) with a capacity of 12 GB. They combine six 16-gigabit chips in a single package. The manufacturing process uses 10nm class (1y-nm) technology of the second generation.
It is noted that the thickness of the modules is only 1,1 millimeters. This will optimize the internal design of cell phones, freeing up, say, more space for the battery.
Samsung says that having 12GB of RAM in smartphones will open up new possibilities. Such devices will be able to use more than five cameras, advanced artificial intelligence tools, large high-resolution screens, fifth generation (5G) communication services, etc.
In addition, the South Korean giant recently introduced 3.0 GB eUFS 512 flash drives for high-end smartphones. These products provide sequential read speeds up to 2100 MB/s. In the second half of this year, it is planned to begin mass production of eUFS 3.0 modules with a capacity of 1 TB.
Source: 3dnews.ru
