2019 iPhone Molds Confirm Unusual Triple Camera

The next iPhone will not be released until September, but leaks about new Apple smartphones began to arrive last year. The schemes of the iPhone XI and iPhone XI Max (we will call them that) that allegedly got into the Network directly from the factory have already been published. Now we are talking about allegedly blank devices for future iPhones used by the manufacturer of cases, and a leak can shed some extra light on the products.

If these materials regarding the 2019 iPhone family are to be believed, it looks like Apple is aiming to differentiate smartphones from its competitors as much as possible. To achieve this, the company will equip them (at least iPhone XI and iPhone XI Max) with a strange and first-of-its-kind triangular rear camera layout.

2019 iPhone Molds Confirm Unusual Triple Camera

Although this configuration has not yet been finally approved by the manufacturer (there have been leaks that testify in favor of another option), it is still most likely for 2019 iPhone family. As you can see, the triple rear camera is present at the top corner of the smartphone. If you look closely at the images, you will notice that the Apple logo is not in its place, and the iPhone inscription is made differently on the two blanks. So we can talk about rather conditional forms of future smartphones (however, they should be quite enough for testing cases).

According to reports, this year Apple will add a third to the existing two cameras, with an ultra-wide-angle lens. It will feature f/2,2 aperture and will be supplied by Genius Electric Optical. Other than that, Apple will make only one change to the capabilities of the rear camera array: it will supposedly increase the pixel area on the main camera sensor, so that the sensitivity will increase.


2019 iPhone Molds Confirm Unusual Triple Camera

In general, the current reports about the 2019 iPhone family do not cause much optimism: in fact, we will talk about the development of the 2018 iPhone. The single-chip system will be new, but it will still be 7nm (although TSMC's process technology will be slightly improved with ULV lithography).



Source: 3dnews.ru

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