Some details about Huawei's upcoming high-end Kirin 990 chip have already been . The official specifications of the Kirin 990 may already be announced at the international electronics fair IFA 2019 in Berlin, which will be held September 6-11.
Although the company is careful not to reveal all the details about its advanced single-chip system, Huawei President for Central, Eastern, Northern Europe and Canada, Yanmin Wang, shared information about his company's best mobile chip, which will form the basis of flagship smartphones. For example, folding due to launch postponement to November, will receive this new single-chip system instead of the Kirin 980 with which it was shown at MWC 2019, and an improved RYYB camera system.
Mr. Wang also confirmed that the Kirin 990 will be manufactured on an improved 7nm process, which is expected to reduce power consumption compared to the Kirin 980. The processor will also meet the main 5G standards for Chinese fifth-generation networks. Obviously, Huawei will build the modem into the SoC, freeing up space inside the smartphone. However, the executive left unanswered the clarifying question of whether the Kirin 990 will support US 5G mmWave frequency bands in the range of 30-300 MHz.
Another major innovation will be support for 4K video recording at 60fps, which is not available at this resolution on the Kirin 980. At the same time, competing Qualcomm Snapdragon 855 and Samsung Exynos 9825 chipsets already work with UHD / 60p. Presentation of the first smartphones using Kirin 990 is scheduled for September 19th.
Source: 3dnews.ru